3D-Printed Low-Profile Interconnect for Light Emitter Coupling
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Solution Overview
Problem
Conventional wire bonds in light emitters mounted on substrates limit the spacing of overlying optical structures, leading to reduced light injection efficiency and increased shadow artifacts, while also adding height and material costs.
Innovation Solution
Implementing low-profile electrical interconnects with a rectangular or oval-shaped cross-section, deposited using 3D printing, that conformally follow the emitter contours, allowing close spacing to optical structures and reducing the need for encapsulating materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire bonds are used to connect light emitters to substrates, then electrical connection is achieved, but the spacing between optical structures is limited and shadow artifacts increase
Solution Approach 1:
The patent extracts the harmful function of wire bonds by replacing them with a low-profile interconnect structure. The wire bond is removed and replaced with a planar interconnect that follows the contour of the light emitter, eliminating the protrusion that limits optical structure spacing and causes shadow artifacts.
Solution Approach 2:
The invention transitions from a three-dimensional wire bond structure to a two-dimensional planar interconnect that conforms to the light emitter surface. This dimensional change allows the interconnect to maintain electrical connection while minimizing vertical protrusion, enabling closer spacing of optical structures.
2Reliability
If conventional wire bonds are used, then electrical connection is provided, but height of the light source increases
Solution Approach 1:
The patent removes the height-increasing wire bond structure and replaces it with a low-profile interconnect that maintains electrical connection while minimizing vertical dimension. The interconnect is designed to follow the contour of the light emitter without adding significant height.
Solution Approach 2:
The solution shifts from a vertical wire bond configuration to a horizontal planar interconnect configuration. This dimensional transformation reduces the vertical height of the light source while maintaining the electrical connection function through a contour-following path.
3Reliability
If conventional wire bonds are used, then electrical connection is achieved, but material costs and encapsulating material requirements increase
Solution Approach 1:
The patent eliminates the need for extensive encapsulating material by removing the wire bond structure that requires protection. The low-profile interconnect design reduces the volume of encapsulant needed while maintaining electrical connection and mechanical stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances light injection efficiency, reduces shadow artifacts, and lowers manufacturing costs by enabling closer placement of optical structures, resulting in more robust and compact illumination systems.
Implementation Method 1
Depositing the electrical interconnect may comprise 3D printing the electrical interconnect
Data Source
AI summary
In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μm or less, or about 35 μm or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.