Low-Profile Inductor With 3D Vertical Coils
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Solution Overview
Problem
There is a technical limitation in reducing the thickness of thin film power inductors while maintaining their functionality, particularly due to constraints in the design of the coil structure and substrate thickness, which hinders the development of low-profile devices with high magnetic material filling capacity.
Innovation Solution
The inductor design incorporates a structure with upper and lower coils embedded in insulating portions, featuring via pads and plating layers with protrusions, and a method of manufacturing that involves sequential lamination and patterning of insulating and metal films to achieve a high aspect ratio and low profile, allowing for efficient magnetic material utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the thickness of the coil and substrate is reduced to achieve low-profile, then the device thickness is reduced, but the space for magnetic material filling is reduced and manufacturing capability is limited
Solution Approach 1:
The patent transitions from planar coil patterns to three-dimensional vertical coils that extend through the substrate thickness. The coils are formed as vias penetrating the substrate with multiple windings around the vertical axis, utilizing the depth dimension to achieve high inductance in a thin profile device. This dimensional change allows magnetic material to be effectively utilized within the limited volume while maintaining low device thickness.
2Length of stationary object
If the coil thickness is reduced for low-profile, then device thickness is reduced, but the coil structure design capability is limited
Solution Approach 1:
The coil structure is segmented into multiple functional components: via pads at the surface, vertical via conduits penetrating the substrate, plating layers forming the conductive windings, and insulating layers separating the windings. This segmentation allows each component to be optimized independently while maintaining overall simplicity in the manufacturing process through sequential deposition and patterning steps.
3Ease of manufacture
If symmetric patterns are formed around the core for plating, then manufacturing is enabled, but the design flexibility for low-profile is limited
Solution Approach 1:
The patent employs asymmetric coil winding patterns where the plating layers are deposited to form non-uniform spiral or helical structures around the via conduits. The asymmetry in the winding geometry allows optimization of the magnetic field distribution and inductance characteristics while maintaining compatibility with the plating manufacturing process. The via pads and conduit positions can be asymmetrically arranged to achieve desired electrical characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of low-profile inductors with high aspect ratio coils, improving magnetic permeability and electrical insulation, thus overcoming the limitations of existing thin film inductor designs.
Implementation Method 1
patterning the first insulating portions using a laser beam to form openings penetrating through the first insulating portions
Implementation Method 2
forming the first plating layers in the openings of the first insulating portions
Data Source
AI summary
An inductor includes a body including an insulating portion formed of a plurality of layers and a magnetic portion surrounding the insulating portion and external electrodes disposed on external surfaces of the body, and a method of manufacturing the same. A coil portion is embedded in the insulating portion, and has a structure in which coil patterns formed on a plurality of layers are stacked while being connected to each other.