3D-Printed Low-Profile Interconnect for Light Emitter Coupling
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Solution Overview
Problem
Conventional wire bonds in light sources limit the close spacing of optical structures to light emitters, leading to reduced light injection efficiency and visual artifacts due to their height and shadowing effects, while also being prone to mechanical instability and increased manufacturing costs.
Innovation Solution
The development of low-profile electrical interconnects with a cross-sectional shape having a width larger than height, formed by 3D printing, which conformally follows the contours of light emitters and substrates, allowing for closer spacing of optical structures and potentially omitting encapsulating materials for improved mechanical stability and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional wire bonds are used to connect light emitters to substrates, then electrical connection is provided, but the height and shadowing effects reduce light injection efficiency and create visual artifacts
Solution Approach 1:
The interconnect transitions from a conventional wire bond configuration to a planar trace structure that lies substantially in the same plane as the light emitter and substrate. This dimensional change eliminates the height component that causes shadowing, allowing light to pass through the interconnect region without obstruction and significantly improving light injection efficiency.
Solution Approach 2:
The harmful shadowing effect is eliminated by removing the vertical height component of the interconnect. The interconnect trace is designed to be coplanar with the light emitter and substrate surfaces, effectively taking out the height dimension that causes visual artifacts and light blocking, while maintaining the necessary electrical connection function.
2Reliability
If conventional wire bonds are used, then electrical connection is provided, but mechanical stability is reduced and manufacturing costs increase
Solution Approach 1:
The interconnect trace is merged with the substrate structure, forming an integrated planar connection system. The trace is deposited directly onto the substrate in the same plane, eliminating the need for separate wire bonding processes. This integration improves mechanical stability by creating a rigid, coplanar structure that is less susceptible to vibration and thermal stress, while reducing manufacturing complexity and cost.
Solution Approach 2:
The mechanical wire bonding process is replaced with a planar trace deposition process. Instead of using flexible wire bonds that require manual or automated bonding equipment, the electrical connection is formed through conformal deposition of conductive material onto the substrate, creating a more stable and manufacturable structure.
3Productivity
If wire bonds are used, then electrical connection is achieved, but optical structures cannot be closely spaced to light emitters
Solution Approach 1:
The interconnect is repositioned from a vertical wire bond configuration to a horizontal planar trace that lies in the same plane as the light emitter. This allows optical structures to be placed much closer to the light emitter without being blocked by the interconnect, as the trace now occupies the same two-dimensional plane rather than extending in the vertical dimension.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The low-profile interconnects enhance light injection efficiency, reduce visual artifacts, and provide a more robust and cost-effective solution by allowing closer spacing of optical structures to light emitters, improving power efficiency and mechanical stability while simplifying manufacturing.
Implementation Method 1
Depositing the electrical interconnect may comprise 3D printing the electrical interconnect
Data Source
AI summary
In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μm or less, or about 35 μm or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.