Low-Profile Interposer Structure for Contact Force and Alignment
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Solution Overview
Problem
Existing interposers face challenges in achieving a low profile while maintaining mechanical strength, ease of manufacture, precise alignment, and reliable contact force, especially in miniaturized electronic systems where misalignment can cause damage.
Innovation Solution
The development of a low-profile interposer with U-shaped electrical contacts and dual compression design, where the contacts are inserted into an insulative housing and locked using heat staking, allowing for precise positioning and deflection to generate contact force, even in tightly packed arrays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the interposer height is reduced to achieve a low profile, then the interposer contributes to miniaturization of electronic devices, but the mechanical strength and ability to generate sufficient contact force deteriorates
Solution Approach 1:
The interposer is segmented into multiple functional layers: an insulative housing, electrical contacts with U-shaped bases, and locking features. This segmentation allows each component to be optimized independently - the housing provides structural strength while the contacts provide electrical connection, resolving the contradiction between low height and mechanical strength
Solution Approach 2:
The electrical contacts are nested within the insulative housing, with the U-shaped bases positioned inside the housing cavity. This nesting arrangement minimizes the overall interposer height while maintaining the structural integrity of both the housing and contacts, enabling low-profile design without sacrificing mechanical strength
2Length of moving object
If the interposer height is reduced, then miniaturization is achieved, but the precision of contact alignment and resistance to misalignment damage deteriorates
Solution Approach 1:
The electrical contacts are pre-positioned within the insulative housing during manufacturing, with the U-shaped bases locked in place. This preliminary positioning ensures precise alignment is achieved during assembly, reducing the tolerance requirements for subsequent mating operations and improving resistance to misalignment damage
Solution Approach 2:
The contact structure uses a U-shaped base configuration that changes the geometric parameters of the contact interface. This shape provides inherent alignment features and increases the margin for misalignment, allowing precise alignment to be maintained even in a compressed low-profile geometry
3Ease of manufacture
If traditional contact structures are used, then manufacturing is simpler, but the ability to generate sufficient contact force in low-profile configurations deteriorates
Solution Approach 1:
The electrical contacts are designed with flexible beams that can deflect dynamically during assembly and operation. When mating components are pressed together, the beams deflect to generate the necessary contact force. This dynamic behavior allows sufficient force generation in a low-profile configuration without complex manufacturing, as the force is generated through elastic deformation rather than rigid structure
Solution Approach 2:
The contact force is generated through controlled elastic deformation of the flexible beams, changing the physical state from rigid to compliant. This parameter change allows the contacts to generate sufficient force through simple deflection mechanics rather than requiring complex spring mechanisms or high rigidity structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of a robust, low-profile interposer with reliable connections and resistance to misalignment damage, achieving contact force and precision in miniaturized electronic systems.
Implementation Method 1
an insulative housing comprising: a top surface and a bottom surface parallel to the top surface; and a plurality of openings extending between the top surface and the bottom surface; and a plurality of electrical contacts, each disposed within a respective opening
Implementation Method 2
The electrical contacts may then be locked into the openings by heat staking
Implementation Method 3
allowing for precise positioning and deflection to generate contact force
Data Source
AI summary
A low profile interposer with multiple electrical contacts held in a housing. Each electrical contact is disposed within a respective opening of the housing. The electrical contact includes a base, a first beam extending from the base to a distal end of the first beam, a second beam extending from the base to a distal end of the second beam. When the electrical contact is in an uncompressed state, a first portion of the distal end of the first beam and a first portion of the distal end of the second beam are positioned between the top surface and the bottom surface; and a second portion of the distal end of the first beam extends above the top surface and a second portion of the distal end of the second beam extends below the bottom surface.