Low Profile Magnetic Inductor with Embedded Coil
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Solution Overview
Problem
Conventional methods for manufacturing low profile magnetic components, such as chip inductors, involve complex multi-step processes and high manufacturing costs due to difficulties in winding conductive coils on small magnetic cores, which are not cost-effective for high-volume, low-cost applications, especially in handheld electronic devices with tight spacing requirements.
Innovation Solution
A magnetic component with a layered construction featuring a coil layer sandwiched between dielectric layers, where the coil is separately formed and embedded within a magnetic core, allowing for efficient assembly and reduced manufacturing steps, using electroforming or other techniques to achieve a low profile dimension of less than 0.65 mm, and employing polymer-based dielectric films for thermal management and reduced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional multi-step manufacturing processes are used for low profile magnetic components, then manufacturing precision can be maintained, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The manufacturing process is segmented into distinct stages: forming the magnetic core structure first, then separately forming the coil winding, and finally assembling them together. This allows each component to be manufactured independently using optimized processes, reducing overall manufacturing complexity while maintaining precision for the low profile dimension.
Solution Approach 2:
The magnetic core and coil winding are prepared in advance as separate pre-formed components before final assembly. The core structure is pre-formed with precise dimensions, and the coil is pre-wound to specifications, enabling simpler final assembly processes while ensuring manufacturing precision is achieved during the specialized preparation stages.
2Manufacturing precision
If complex multi-step winding processes are used for small magnetic cores, then coil placement precision can be achieved, but manufacturing cost increases
Solution Approach 1:
The coil winding process is segmented and performed separately from the core manufacturing. Pre-formed coil windings are manufactured using optimized winding techniques to achieve precise placement, then assembled to the core in a single step. This separates the complex precision work from the simple assembly, reducing overall manufacturing cost.
Solution Approach 2:
Standardized pre-formed coil windings can be manufactured in bulk and reused across multiple components. The same coil design can be copied and assembled to different core variations, reducing per-unit manufacturing cost while maintaining consistent coil placement precision through standardized processes.
3Volume of moving object
If component size is reduced for compact devices, then device compactness improves, but thermal management becomes more difficult
Solution Approach 1:
The magnetic component uses composite construction with the magnetic core and dielectric layers forming a multi-material structure. This composite approach allows integration of thermally conductive materials in the dielectric layers or interface regions, enabling effective heat dissipation pathways within the compact component volume without increasing overall size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the cost-effective and efficient production of low profile magnetic components with improved manufacturability, reduced thermal losses, and higher manufacturing yields, suitable for compact electronic devices without increasing component size.
Implementation Method 1
wherein the coil is separately formed and embedded within a magnetic core, allowing for efficient assembly and reduced manufacturing steps, using electroforming or other techniques
Data Source
AI summary
Magnetic components such as power inductors for circuit board applications include pressure laminate constructions involving flexible dielectric sheets that may integrally include magnetic powder materials. The dielectric sheets may be pressure laminated around a coil winding in an economical and reliable manner, with performance advantages over known magnetic component constructions.