Low-Profile Memory Package With Heat Spreader Cavity
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Solution Overview
Problem
The integration of components with different profiles or z-heights in multi-die package assemblies poses challenges for system thermal management, as existing solutions often result in higher profiles that are not desirable for thinner products.
Innovation Solution
A low-profile memory apparatus is developed, featuring an inverted memory package attached to a module layer with a heat spreader component that partially encloses the package, allowing for efficient thermal management while maintaining a lower z-height assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If components with different profiles are integrated into multi-die package assemblies, then functional versatility is improved, but system thermal management complexity increases
Solution Approach 1:
The patent merges the heat spreader component with the memory package substrate to form an integrated thermal management structure. The heat spreader is directly coupled to the memory package and extends to contact other components in the multi-die assembly, creating a unified thermal pathway that simplifies heat dissipation across components with different profiles.
Solution Approach 2:
The heat spreader component serves multiple functions: it acts as a thermal management element for the memory package, provides mechanical support, and creates electrical connections through integrated vias. This multi-functionality reduces the need for separate components and simplifies the overall assembly.
2Temperature
If heat spreader components are added to equalize component profiles, then thermal management is improved, but the overall assembly z-height increases
Solution Approach 1:
The heat spreader is designed with an L-shaped profile that extends in the horizontal plane rather than adding significant vertical height. This allows the heat spreader to contact multiple components with different z-heights while maintaining a low overall profile by utilizing horizontal space instead of vertical stacking.
Solution Approach 2:
The heat spreader features varying thickness and geometry at different locations to accommodate components with different profiles. The heat spreader is thicker where it contacts higher components and thinner where it contacts lower components, allowing efficient thermal contact across the entire assembly without uniform height increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces system thermal challenges and costs, enabling the creation of thinner devices by maintaining a lower z-height assembly compatible with system thermal solutions.
Implementation Method 1
a heat spreader component that partially encloses the package
Data Source
AI summary
A low-profile memory apparatus that is compatible with system thermal solutions. The apparatus includes a substrate layer with an upper surface and a lower surface, a portion of the substrate layer having a first arrangement of conductive contacts located on the lower surface. A memory package is inverted and attached to the first arrangement of conductive contacts. A heat spreader component comprising a cavity is included. The memory package and the portion of the substrate layer having the first arrangement of conductive contacts located in the cavity. A second arrangement of conductive contacts is located on the lower surface of the substrate layer, external to the heat spreader component, to attach the apparatus to another substrate or printed circuit board in a multi-die assembly.