Low Profile Integrated Package Design Without Encapsulation
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Solution Overview
Problem
Current package-on-package (PoP) devices have a high profile, which limits their integration in smaller devices due to increased height, and require costly encapsulation layers that complicate fabrication and increase costs.
Innovation Solution
A low profile package design featuring a substrate with an interposer interconnect and cavity, a redistribution portion with redistribution interconnects, and a barrier layer, where the first die is coupled to the redistribution portion through the cavity without an encapsulation layer, reducing height and fabrication complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional package-on-package design with encapsulation layers is used, then structural support and protection are provided, but package height increases to 500 microns or greater per package
Solution Approach 1:
The patent removes the encapsulation layer from the package structure. The substrate provides structural support through its rigid construction with through-substrate vias and metal rings, eliminating the need for encapsulation material while reducing package height from 500+ microns to under 500 microns per package
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides structural support, electrical interconnection through through-substrate vias, mechanical attachment for the die, and protection for internal components. This multi-functionality replaces the separate encapsulation layer that traditionally provided protection and support
2Reliability
If encapsulation layers are used to protect the die and solder balls, then reliability is improved, but fabrication complexity and cost increase
Solution Approach 1:
The protective and support functions traditionally provided by the encapsulation layer are merged into the substrate structure itself. The substrate's rigid construction, through-substrate vias, and metal rings provide both mechanical support and protection, eliminating the need for separate encapsulation material and simplifying fabrication
Solution Approach 2:
Instead of adding an encapsulation layer on top of the die and solder balls for protection, the patent inverts the approach by providing protection and support through the substrate structure from below and the sides, eliminating the need for top encapsulation
3Stability of the object's composition
If non-functional metal rings are included in the substrate, then structural integrity is maintained, but device complexity and cost increase
Solution Approach 1:
The patent removes non-functional metal rings from the substrate design. Structural integrity is maintained through alternative means such as through-substrate vias, substrate material selection, and optimized substrate thickness, eliminating unnecessary components that added complexity and cost without providing functional benefit
Data Source
AI summary
A package that includes a substrate comprising an interposer interconnect and a cavity, a redistribution portion coupled to the substrate, the redistribution comprising a plurality of redistribution interconnects, and a first die coupled to the redistribution portion through the cavity of the substrate. A substantial region between a side surface of the first die and the substrate is free of an encapsulation layer. In some implementations, the substrate is free of a metal ring that surrounds the first die. In some implementations, the redistribution portion comprises a barrier layer and a first interconnect coupled to the barrier layer. The barrier layer is coupled to the interposer interconnect.