Low Profile Power Conversion Module Embedded PCB Design
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Solution Overview
Problem
Current power conversion systems face challenges in space-constrained environments, such as ultraportable notebook computers and smartphones, due to height restrictions, heat dissipation, and electromagnetic interference issues, as off-the-shelf components are not optimized for these dimensions.
Innovation Solution
A low profile power conversion system module is designed with a thin planar shape, featuring an embedded PCB, a power silicon device, and a magnetic component, with input/output terminals on the side, allowing for compact placement within a system PCB or on its surface, optimizing space usage and reducing EMI through innovative thermal and electrical design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If off-the-shelf power conversion components are used, then industry standard footprint is maintained, but height restriction requirements cannot be met
Solution Approach 1:
The patent changes the dimensional parameters of power conversion components from standard industry footprints to customized low-profile configurations. The power conversion module is designed with a reduced height parameter while maintaining functional equivalence, allowing it to fit space-constrained environments like ultraportable notebooks and tablets without requiring standard component dimensions.
Solution Approach 2:
The patent transitions from two-dimensional footprint optimization to three-dimensional space utilization. By redistributing component volumes across height, width, and depth dimensions, the design achieves a low-profile form factor that fits within restricted z-height constraints while maintaining adequate thermal and electrical performance margins.
2Area of stationary object
If components are tightly positioned to save space, then area occupancy is reduced, but heat dissipation and EMI problems worsen
Solution Approach 1:
The patent embeds the power conversion module within a cavity formed in the system PCB, nesting the power conversion components inside the PCB structure. This nesting approach saves occupied area on the PCB surface while the cavity design provides adequate spacing for heat dissipation and EMI management, resolving the contradiction between compactness and thermal/electrical performance.
Solution Approach 2:
The patent applies different design qualities to different regions: the power conversion module uses high-density component placement for area efficiency, while the surrounding PCB areas maintain adequate spacing and thermal vias for heat dissipation. The cavity structure provides localized EMI shielding around the power components, allowing tight positioning without compromising thermal or electromagnetic performance.
Data Source
AI summary
Embedded PCB (printed circuit board) is used for the packaging and assembly of a low profile power conversion system module that can be employed in space constrained environment of small computer/electronic systems. The low profile power conversion system module may include an embedded PCB, a power silicon device embedded within the PCB, a magnetic component which is either embedded within the PCB or disposed on the PCB, or input/output terminals disposed on the side of the embedded PCB. The embedded PCB and the magnetic component may be thin planar shaped to save vertical space. The low profile power conversion system module can be placed inside a cavity formed in the system PCB to save even more vertical space.