Low-Profile Surface-Mounted Receptacle With Force-Isolating Metal Cage
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Solution Overview
Problem
Existing electrical connectors for electronic circuit boards face challenges in conserving space and minimizing signal loss, particularly with surface-mounted solder joints, where forces at the contact beam can compromise the mechanical integrity of the solder joint due to creep.
Innovation Solution
A low-profile electrical connector design featuring a metal cage with a bent contact beam that absorbs lateral forces, transferring them to the housing rather than the solder joints, using a plastic housing with heat-staked contacts and standoff feet for clearance, and chamfered holes for easy pin insertion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vertical beams are used to clamp the lead of an electronic device, then electrical signal transmission is achieved, but forces at the contact beam affect the integrity of the solder joint
Solution Approach 1:
The patent introduces a low-profile socket as an intermediary component between the electronic device lead and the circuit board. This socket absorbs and isolates the mechanical forces generated at the contact beam, preventing them from being transmitted to the solder joint. The socket acts as a buffer that maintains electrical connectivity while protecting the vulnerable solder joint from force-induced failure.
2Volume of moving object
If a low-profile connector is used to conserve space, then space efficiency is improved, but the mechanical integrity of solder joints becomes more vulnerable to creep
Solution Approach 1:
The low-profile socket serves as a protective intermediary that decouples the mechanical stress from the solder joint while maintaining the compact form factor. By positioning the force-absorbing contact beam within the socket body rather than extending it outward, the design achieves both space conservation and solder joint protection.
3Adaptability or versatility
If repeated insertion of small electronic devices is enabled, then adaptability is improved, but signal loss increases due to cumulative stress on connections
Solution Approach 1:
The socket acts as a reusable intermediary that absorbs mechanical stress during repeated insertions and extractions. By containing the contact beam and its associated forces within the socket structure, the design protects the permanent solder joint from cumulative damage that would otherwise lead to signal loss over time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively isolates forces from the solder joints, maintaining their integrity and allowing for repeated insertion of small devices while minimizing signal loss and ensuring reliable electrical connectivity.
Implementation Method 1
a beam bent downward from a top portion, to engage the pins inserted into the holes
Implementation Method 2
the top portions of the contacts have respective holes for receiving portions of the housing, for heat staking of the contacts to the housing
Data Source
AI summary
A very low profile connector (e.g., less than 1.9 mm high) utilizes stored energy in a horizontal beam to augment contact displacement and is contained in a cage that will eliminate any transfer of forces to the solder joints that hold the connector to the circuit board.