Low Profile Transducer Module With Tiered MEMS Lid
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Solution Overview
Problem
Existing electronic devices face challenges in minimizing package size due to the thickness of substrates and components, which hinders the development of smaller, thinner consumer electronics.
Innovation Solution
A low-profile transducer module is designed with a substrate and a MEMS structure, where the MEMS structure is suspended over a perforation in the substrate and covered by a lid, allowing for a tiered or step-like configuration that reduces overall thickness while maintaining functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional mounting techniques with substrates are used, then components can function properly, but the overall package size increases
Solution Approach 1:
The patent transitions from traditional planar mounting to a three-dimensional stacked configuration where the lid is positioned at a different vertical level than the substrate, creating a tiered structure that reduces the horizontal footprint while maintaining all necessary functional connections
Solution Approach 2:
The lid is positioned to overhang the substrate, creating a nested arrangement where components are arranged in overlapping vertical layers rather than flat adjacent positions, maximizing space utilization and reducing overall package dimensions
2Length of stationary object
If substrate thickness is reduced, then device thickness decreases, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The lid is pre-formed with integrated acoustic seal structures and mounting features before final assembly, ensuring that sealing and positioning functions are built-in from the start rather than requiring additional precision operations during assembly
Solution Approach 2:
The acoustic seal, lid structure, and mounting features are combined into a single integrated lid component, reducing the number of separate parts and interfaces that would require high manufacturing precision
Data Source
AI summary
A transducer structure is disclosed. The transducer structure may include a substrate with a MEMS structure located on a first side of the substrate and a lid coupled to the first side of the substrate and covering the MEMS structure. The substrate may include an electric contact which is laterally displaced from the lid on the first side of the substrate and electrically coupled to the MEMS structure.