Low-Profile Clip Constraining Wire Motion to Reduce Electrical Noise
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Solution Overview
Problem
Existing methods for routing and securing wires in electronic devices lead to increased electrical noise due to wire motion and variability in routing, which affects device performance, and are costly with reliability and repeatability issues.
Innovation Solution
A low-profile mechanical clip with a trench to constrain wires, fabricated using injection molding or machining, that reduces mechanical degrees of freedom and can be coupled to a surface using adhesive or tape, allowing for consistent and reproducible wire routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If wires are routed freely without mechanical constraint, then ease of assembly is improved, but electrical noise increases due to wire motion
Solution Approach 1:
The housing is segmented into a base and a separate clip component that can be assembled together. The clip is further segmented into a body and a constraint element that can be independently positioned to secure the wire, allowing for easy assembly while providing mechanical constraint to reduce electrical noise.
Solution Approach 2:
The mechanical clip acts as an intermediary component between the wire and the housing. It provides a standardized interface that mechanically constrains the wire without requiring direct modification of the housing or complex assembly procedures, thereby reducing electrical noise while maintaining ease of assembly.
2Ease of manufacture
If adhesive or tape is used to secure wires, then manufacturing cost is reduced, but reliability and repeatability deteriorate
Solution Approach 1:
The mechanical clip is designed to be self-securing through its constraint mechanism that engages with the wire and housing without requiring additional adhesives or tapes. The clip's geometry provides inherent mechanical retention, ensuring reliable and repeatable wire positioning while maintaining low manufacturing cost.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (adhesive/tape) with a purely mechanical constraint system. The clip uses geometric features such as slots, tabs, or clamping surfaces to secure the wire mechanically, eliminating the need for adhesives and providing superior reliability and repeatability.
3Reliability
If a high-profile clip is used to constrain wires, then wire constraint reliability is improved, but device profile increases
Solution Approach 1:
The constraint function is moved from the vertical dimension (height) to the horizontal dimension (planar configuration). The clip constrains the wire through lateral engagement features such as side walls, slots, or clamping surfaces that operate in the plane of the housing, maintaining a low profile while ensuring reliable wire positioning.
Solution Approach 2:
The clip is designed as a thin, low-profile component that provides mechanical constraint through its geometric configuration rather than through thickness. The constraint functionality is achieved through planar features such as recesses, slots, or edge profiles that secure the wire without requiring significant vertical height.
Data Source
AI summary
A reduced or low-profile mechanical clip is described. This mechanical clip may include a trench that constrains the mechanical degrees of freedom of wires, such as those between an interface circuit and an antenna in an electronic device. Moreover, the mechanical clip may have a low height (such as less than 3 mm) so it can fit in a confined space between components in the interior of the electronic device. The mechanical clip may be mountable on a surface in the interior of the electronic device, such as on a printed circuit board or on an inner surface of a chassis or external housing of the electronic device.