Localized Low Resistance Pathway with Sealing Feature
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Solution Overview
Problem
Existing methods for achieving low electrical resistance bonding between components, such as in aerospace applications, result in increased weight and manufacturing complexity due to the use of extensive sealants and fasteners across the entire interface, which is not only costly but also introduces potential for electrical shorts and environmental corrosion.
Innovation Solution
A localized low resistance pathway is created using a flexible member, such as a tab, held in contact with an interface surface by a fastener, isolated by a sealing feature like a groove and sealed with sealant, reducing the need for extensive sealant and fasteners, and incorporating a fillet of sealant for environmental protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire split line between interfacing components is used with fillet of sealant and bonding straps, then a low resistance electrical bond is achieved, but weight and manufacturing complexity increase
Solution Approach 1:
The patent divides the bonding interface into two distinct zones: a localized low resistance bonding pathway and the remaining interface area. The bonding pathway is confined to a specific region defined by a groove, concentrating the electrical bonding function in a segmented manner rather than distributing it across the entire split line. This segmentation allows reduction of sealant and fastener quantity while maintaining electrical bond quality.
Solution Approach 2:
The patent applies different properties to different regions of the interface. The localized bonding pathway region has high electrical conductivity and sealing properties, while the remaining interface area has different characteristics. This local quality approach concentrates the low resistance bonding function in a specific area rather than requiring uniform bonding across the entire interface, thereby reducing overall material usage and weight.
2Reliability
If the entire split line between interfacing components is used with fillet of sealant and bonding straps, then a low resistance electrical bond is achieved, but manufacturing and repair complexity increase
Solution Approach 1:
The bonding interface is segmented into a localized pathway defined by the groove, separating the critical electrical bonding function from the rest of the interface. This segmentation simplifies manufacturing by concentrating fastener and sealant application to a specific region, and simplifies repair by localizing the bonding pathway that needs attention.
Solution Approach 2:
The patent extracts the essential low resistance bonding function from the entire interface and concentrates it in a localized pathway. By taking out only the necessary portion for electrical bonding and isolating it with a groove, the design eliminates unnecessary complexity associated with bonding the entire split line while maintaining electrical bond quality.
3Reliability
If extensive sealant and fasteners are used across the entire interface, then electrical bonding is achieved, but cost increases
Solution Approach 1:
The interface is segmented into a localized bonding pathway, reducing the quantity of sealant and fasteners needed. The groove defines this segmented region, confining the electrical bonding function to a specific area and eliminating the need for extensive materials across the entire interface.
Solution Approach 2:
The patent applies high-quality sealing and bonding properties locally to the bonding pathway region rather than uniformly across the entire interface. This local quality approach maintains electrical bond quality in the critical pathway while reducing overall material consumption.
4Reliability
If the entire interface is used for bonding, then a durable bond is achieved, but the assembly is more susceptible to electrical shorts and environmental corrosion
Solution Approach 1:
The groove segments the interface into a isolated bonding pathway and the remaining area. This segmentation creates a defined boundary that protects the bonding region from environmental factors and potential electrical shorts, while maintaining bond durability within the confined pathway.
Solution Approach 2:
The patent extracts the bonding pathway from the general interface area and isolates it with a groove. This extraction and isolation reduce susceptibility to electrical shorts and environmental corrosion by creating a distinct, protected region for electrical bonding, separating it from areas more exposed to harmful factors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the weight and cost of the assembly, simplifies manufacturing and repair, while maintaining a durable and low-resistance electrical bond, effectively addressing the challenges of electrical shorts and environmental corrosion.
Implementation Method 1
The fastener compresses the flexible member to contact the surface
Implementation Method 2
provides for a low electrical resistance pathway between components
Implementation Method 3
The sealing feature forms an interior edge of at least one of the flexible member and the surface
Data Source
Figure 1
Figure 2~2A
AI summary
A low resistance pathway (24) includes a flexible member (30), a surface (32) interfacing the flexible member, a sealing feature (28) and a fastener (34). The sealing feature (28) forms an interior edge of at least one of the flexible member (30) and the surface (32). The fastener (34) compresses the flexible member (30) to contact the surface (32).