Low-Strength Backfill Material for Thermal Management

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Solution Overview

Problem

Current backfill materials in urban areas face challenges with high strength, poor thermal conductivity, and difficulty in re-excavation due to high cementitious content and long hardening times, which can damage underground utilities and hinder construction efficiency.

Innovation Solution

A low-strength backfill material with a 28-day compressive strength less than 2.0 MPa, incorporating a cementitious binder, fine aggregates, filler, and thermally conductive particles, along with a density-controlling agent to achieve high flowability and thermal conductivity, allowing for easy excavation and rapid setting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If high cementitious content is used to increase strength, then strength is improved, but excavatability deteriorates

Engineering Contradiction:
Improvecompressive strengthVSAvoidexcavatability
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The patent applies parameter changes by precisely controlling the cementitious content to 1-10% by weight and using density-controlling agents to achieve specific density ranges (1600-2000 kg/m3). This optimization allows the backfill to achieve sufficient strength (0.3-2.0 MPa) while maintaining excavatability, resolving the contradiction between strength and ease of excavation.

Inventive Principle:
Principle #35Parameter changes

2Strength

If high cementitious content is used to increase strength, then strength is improved, but thermal conductivity deteriorates

Engineering Contradiction:
Improvecompressive strengthVSAvoidthermal conductivity
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The patent uses composite materials by incorporating thermally conductive particles (graphite, metal powders, ceramic particles) into the backfill mixture. These particles form thermal conduction networks that significantly improve thermal conductivity (k>1.0 W/mK) without requiring high cementitious content, thus resolving the contradiction between strength and thermal conductivity.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the physical and chemical parameters of the backfill by adding thermally conductive additives and controlling density within specific ranges (1600-2000 kg/m3). This allows the material to achieve both adequate strength and improved thermal conductivity simultaneously.

Inventive Principle:
Principle #35Parameter changes

3Strength

If normal hardening time is used for concrete, then strength development is sufficient, but construction time increases

Engineering Contradiction:
Improvecompressive strengthVSAvoidhardening time
Core Design Contradiction:
StrengthVSLoss of time

Solution Approach 1:

The patent applies parameter changes by using calcium sulfoaluminate cement (CSA) or alumina cement instead of ordinary Portland cement, and by controlling water-cement ratios and adding accelerators. These changes enable rapid strength development where 0.3 MPa is achieved within 8 hours, reducing construction time significantly while maintaining sufficient strength.

Inventive Principle:
Principle #35Parameter changes

4Ease of operation

If low density is used to improve excavatability, then excavatability is improved, but thermal conductivity deteriorates

Engineering Contradiction:
ImproveexcavatabilityVSAvoidthermal conductivity
Core Design Contradiction:
Ease of operationVSTemperature

Solution Approach 1:

The patent uses composite materials by incorporating thermally conductive particles (graphite flakes, metal powders, ceramic particles) into the low-density backfill matrix. These particles create thermal conduction pathways that compensate for the low density, achieving thermal conductivity >1.0 W/mK while maintaining density-controlled excavatability (1600-2000 kg/m3).

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent applies local quality by creating heterogeneous structures where thermally conductive particles are distributed within the matrix. This creates local thermal conduction channels that improve overall thermal conductivity without requiring high bulk density, thus maintaining excavatability while improving heat dissipation.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables hand-excavation of trenches, prevents damage to underground utilities by dissipating heat effectively, and reduces construction time with a compressive strength of 0.3-1.4 MPa and thermal conductivity greater than 1.1 W/mK, making it suitable for densely populated urban areas.

Implementation Method 1

thermally conductive particles are evenly-dispersed throughout the backfill. The thermally conductive particles have a size range of approximately 0.01 microns to 500 microns in an amount of approximately 0.1 to 10 weight percent

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11078117B2Thermally-conductive, low strength backfill material
Publication Date: 2021.08.03 HONG KONG APPLIED SCI & TECH RES INST
  • US11078117B2 patent drawing
  • US11078117B2 patent drawing
  • US11078117B2 patent drawing

AI summary

A low strength backfill material having a 28 days compressive strength less than approximately 2.0 MPa is provided. The backfill is suitable for use in areas with dense underground utilities due to its high excavatability and good thermal conductivity. The backfill includes a cementitious binder of approximately 1 weight percent to approximately 10 weight percent and fine aggregates in an amount of approximately 40 to approximately 75 weight percent. Filler is provided at 20 microns to approximately 100 microns for high flowability. A density-controlling agent of 0.0001-5 weight percent is used such that the density of a cured backfill material is approximately 1600 kg/m3 to 2000 kg/m3. Thermally conductive particles having a size range of approximately 0.01 microns to 500 microns in an amount of approximately 0.1 to 10 weight percent are evenly dispersed throughout the backfill.