Low Surface Tension Fluid Transport for Substrate Pattern Collapse
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Solution Overview
Problem
In substrate processing systems, the contact angle of the substrate surface can be large, leading to partial drying during transport from batch to single-wafer processors, causing pattern collapse on the substrate surface.
Innovation Solution
A substrate processing apparatus that includes a batch processor for collective processing of substrates, a single-wafer processor for individual processing, and a transport system with a fluid supplier that uses a low surface tension fluid, such as IPA, to reduce the contact angle and surface tension on the substrates, preventing pattern collapse during transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are transported from batch processor to single-wafer processor, then substrate processing efficiency is improved, but pattern collapse occurs due to partial drying
Solution Approach 1:
A low surface tension fluid (such as isopropyl alcohol) is introduced as an intermediary substance between the substrate and the high surface tension rinsing liquid. This intermediary fluid modifies the surface properties of the substrate, reducing the contact angle and preventing the substrate edge from drying out during transport, thereby eliminating pattern collapse while maintaining processing efficiency
Solution Approach 2:
The surface tension parameter of the liquid is changed by adding a low surface tension fluid to the rinsing liquid. This parameter change reduces the contact angle between the liquid and substrate surface, fundamentally altering the wetting behavior to prevent partial drying and pattern collapse during substrate transport
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a low surface tension fluid effectively suppresses pattern collapse and maintains the integrity of the substrate surface by ensuring uniform wetting and preventing sticking issues during transport, thereby improving processing yield.
Implementation Method 1
a low surface tension fluid having a lower surface tension than the rinsing liquid to at least one of the processing tank and the substrates
Implementation Method 2
The use of a low surface tension fluid effectively suppresses pattern collapse and maintains the integrity of the substrate surface by ensuring uniform wetting
Data Source
AI summary
A substrate processing apparatus includes: a batch processor configured to collectively process a lot including plural substrates; a single-wafer processor configured to process the substrates included in the lot one by one; and a transport portion configured to deliver the substrates one by one between the batch processor and the single-wafer processor. The batch processor includes a processing tank configured to store a processing liquid including a rinsing liquid. The transport portion includes a fluid supplier configured to supply, after receiving the substrates included in the lot in the processing tank and until delivering the substrates to the single-wafer processor, a low surface tension fluid having a lower surface tension than the rinsing liquid to at least one of the processing tank and the substrates.