Low Swap Two-Phase Cooled Diode Laser Package Thermal Management
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Solution Overview
Problem
Laser diode packages face challenges with extreme size, weight, and power requirements, which compromise their reliability and power capabilities in various applications, necessitating improved thermal management solutions.
Innovation Solution
A conductive block with parallel stepped surfaces and a two-phase cooling unit is used to efficiently manage heat generated by laser diodes, featuring a common thermal path and a coupling surface for effective heat dissipation, along with a design that includes removable inserts and a compact configuration to reduce volume and mass while maintaining high power output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling methods (heat dissipation layers, heat spreaders, heat sinks) are used, then thermal management is provided, but device volume and mass increase
Solution Approach 1:
The patent merges the thermal management function directly into the package substrate by integrating a heat spreader layer within the multilayer structure. This eliminates the need for separate external heat sinks or cooling components, thereby providing effective thermal management while minimizing device volume and mass.
Solution Approach 2:
The heat spreader layer is nested within the multilayer package substrate structure, positioned between functional layers. This nested configuration allows thermal management to be embedded within the device architecture itself, reducing the need for external cooling components and minimizing overall device volume.
2Temperature
If conventional cooling methods (heat dissipation layers, heat spreaders, heat sinks) are used, then thermal management is provided, but device mass increases
Solution Approach 1:
The thermal management function is merged with the package substrate by incorporating a heat spreader layer within the multilayer structure. This integration eliminates the need for separate heavy cooling components such as external heat sinks, thereby providing effective thermal management while minimizing device mass.
Solution Approach 2:
The heat spreader layer is nested within the multilayer package substrate, allowing thermal management functionality to be embedded within the lightweight substrate structure. This approach avoids adding separate heavy cooling components, thus providing thermal management while minimizing overall device mass.
3Reliability
If laser diodes are assembled in protective packages, then device protection is provided, but device power capabilities are reduced
Solution Approach 1:
The patent segments the package substrate into a multilayer structure with distinct functional layers including a heat spreader layer, signal transmission layers, and protection layers. This segmentation allows each layer to be optimized for its specific function, enabling effective heat management and signal transmission while maintaining device protection, thereby preserving power capabilities despite the protective packaging.
Solution Approach 2:
The package substrate employs composite material construction with multiple layers having different properties - conductive layers for heat spreading, insulating layers for electrical isolation, and protective layers for mechanical protection. This composite structure provides comprehensive device protection while maintaining excellent thermal and electrical performance, thus preserving power capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a low thermal resistance, reduced volume and mass, and high power output, with a volume-to-power ratio of 0.4 cm3/W or smaller and a mass-to-power ratio of 0.5 g/W or smaller, enabling efficient fiber-coupled output power of 500 W or greater.
Implementation Method 1
a two-phase cooling unit including a coupling surface attached to the base surface of the conductive block and wherein the two-phase cooling unit is situated to conduct heat generated through the emission of laser beams from the laser diodes along the thermal paths
Implementation Method 2
the two-phase cooling unit is situated to conduct heat generated through the emission of laser beams from the laser diodes along the thermal paths
Data Source
AI summary
Apparatus include a conductive block including a base surface and a plurality of parallel stepped surfaces opposite the base surface and defining respective mounting surfaces situated to receive respective laser diodes having respective thermal paths defining a common thermal path distance from the mounting surfaces to the base surface, and a two-phase cooling unit including a coupling surface attached to the base surface of the conductive block and wherein the two-phase cooling unit is situated to conduct heat generated through the emission of laser beams from the laser diodes along the thermal paths.