Low-Tack Polysiloxane Resin Composition for Clean Sealing
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Solution Overview
Problem
Conventional silicone sealing members in semiconductor apparatuses exhibit tack properties, leading to issues such as pickup tool adherence, LED sticking, and garbage adhesion during production, and existing evaluation methods lack accuracy for low-tack viscoelastic materials.
Innovation Solution
A curable resin composition comprising polysiloxanes with specific alkenyl and hydrosilyl groups, which forms a cured product with low tack properties and incorporates a method for measuring surface tackiness using a contact and separation test to ensure accurate evaluation and reduced garbage adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional silicone sealing members are used, then heat resistance is achieved, but tack properties cause pickup tool adherence and LED sticking
Solution Approach 1:
The patent modifies the chemical composition parameters of the silicone resin by incorporating specific ratios of phenyl groups (0.1-0.6 mol fraction) and controlling the molecular structure to achieve both heat resistance and reduced tack properties, resolving the contradiction between thermal performance and handling ease
Solution Approach 2:
The patent creates a composite sealing material combining methylsilicone base resin with phenylsilicone modifiers and specific additives, achieving a material that simultaneously provides heat resistance, low tack, and improved workability that neither component could achieve alone
2Reliability
If conventional silicone sealing members are used, then sealing function is provided, but garbage easily adheres to the sealing member surface
Solution Approach 1:
The patent adjusts surface energy parameters of the sealing material by controlling phenyl group content and molecular structure, creating a surface that maintains sealing effectiveness while reducing garbage adhesion through optimized chemical composition
3Ease of operation
If conventional evaluation methods are used, then general tack properties can be assessed, but accurate measurement of low-tack viscoelastic materials is not achieved
Solution Approach 1:
The patent replaces conventional mechanical tack evaluation methods with a contact angle measurement system that uses liquid droplet behavior to quantify surface tackiness, achieving accurate measurement of low-tack viscoelastic materials through optical and surface tension principles rather than mechanical force
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable resin composition effectively reduces tack properties and garbage adhesion, enhancing the workability and quality of semiconductor apparatuses, and provides a reliable method for quantitatively measuring tackiness across various viscoelastic materials.
Implementation Method 1
A curable resin composition comprising at least one polysiloxane (A) selected from the group consisting of polyorganosiloxane (A1) having not less than 2 alkenyl groups in the molecule and polyorganosiloxysilalkylene (A2) having not less than 2 alkenyl groups in the molecule, and at least one polysiloxane (B) selected from the group consisting of polyorganosiloxane (B1) having not less than 2 hydrosilyl groups in the molecule and polyorganosiloxysilalkylene (B2) having not less than 2 hydrosilyl groups in the molecule
Data Source
AI summary
Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D>0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mm2 in separation load evaluation and/or a total separation load of not more than 0.018 N·mm per mm2.