Low-Temperature Conductive Coating for Stable EMI Shielding Layers
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Solution Overview
Problem
Conductive coating materials used for forming shielding layers on electronic components require high curing temperatures, which can damage the components and increase production costs, and existing materials lack sufficient storage stability and conductivity.
Innovation Solution
A conductive coating material comprising epoxy resin, metal particles, an isocyanate curing agent, and an organic metal catalyst, which can be cured at lower temperatures (120° C to 150° C) to form a shielding layer with good conductivity and stability, reducing component damage and production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive coating materials are used to form shielding layers, then good shielding performance is achieved, but high curing temperatures damage electronic components
Solution Approach 1:
The patent changes the chemical composition parameters of the coating material by incorporating specific catalysts (metal salts like zinc stearate, calcium stearate) and adjusting the binder resin type (polyester resin, polyurethane resin) to enable curing at lower temperatures (80-150°C) while maintaining shielding effectiveness
Solution Approach 2:
The patent creates a composite coating material system combining conductive metal particles (silver, copper, nickel) with polymer binder resins and curing catalysts, forming a multi-component system that achieves both low-temperature curability and effective electromagnetic shielding
2Reliability
If high curing temperatures are used to cure the conductive coating material, then complete curing is achieved, but production costs increase
Solution Approach 1:
The patent modifies the curing process parameters by introducing catalysts that lower the activation energy required for curing, enabling the reaction to proceed efficiently at reduced temperatures (80-150°C) thereby reducing energy consumption while achieving complete curing
3Manufacturing precision
If the conductive coating material has good application stability, then uniform coating is achieved, but storage stability may be compromised
Solution Approach 1:
The patent uses solvent components as intermediaries that maintain the coating material in a stable, fluid state during storage and application, enabling uniform coating application while preventing premature curing through careful selection of solvent types and ratios
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material effectively forms a shielding layer with high conductivity and stability at lower curing temperatures, minimizing electronic component damage and reducing heating costs while maintaining storage stability and application uniformity.
Implementation Method 1
0.5 to 5 parts by weight of a curing catalyst (E)... The conductive coating material of the present invention containing the curing catalyst (E) has a lower curing temperature
Implementation Method 2
1 to 150 parts by weight of a curing agent (C)... Preferably, in the conductive coating material of the present invention, the curing agent (C) is an isocyanate curing agent
Implementation Method 3
500 to 2500 parts by weight of metal particles (B)... the metal particles (B) are at least one selected from the group consisting of silver powder, silver-coated copper powder, and silver-coated copper alloy powder
Data Source
AI summary
The present invention provides a conductive coating material curable at low temperatures. The present invention relates to a conductive coating material containing: 100 parts by weight of an epoxy resin-containing binder component (A); 500 to 2500 parts by weight of metal particles (B); 1 to 150 parts by weight of a curing agent (C); 20 to 800 parts by weight of a solvent (D); and 0.5 to 5 parts by weight of a curing catalyst (E).