Low-Temperature Curing Agent Composition Tolerant to Mixing Ratio Errors
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Solution Overview
Problem
Two-part mixing curable composition systems face challenges in achieving precise mixing ratios, leading to inadequate curing and potential outgassing and bleeding due to human error or improper mixing ratios, especially when used in low-temperature applications for electronic components.
Innovation Solution
A curing agent composition comprising an initiator with a basic substance and a 2-methylene-1,3-dicarbonyl compound, which allows for flexible mixing ratios and prevents outgassing by incorporating a 2-methylene-1,3-dicarbonyl compound with a structural unit represented by formula (I), ensuring effective curing at low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a two-part mixing curable composition system is used, then curing can be achieved, but precise mixing ratios are difficult to achieve leading to inadequate curing and potential outgassing
Solution Approach 1:
The patent combines the base resin and curing agent into a single-component system containing both the 2-methylene-1,3-dicarbonyl compound and the basic substance. This eliminates the need for separate mixing operations, ensuring consistent composition and preventing outgassing caused by improper mixing ratios.
Solution Approach 2:
The patent specifies precise parameter ranges for the 2-methylene-1,3-dicarbonyl compound (molecular weight 180-10,000, specific structural unit) and the basic substance (pKa ≥ 8) to optimize curing performance. These parameter controls ensure reliable curing without requiring precise mixing operations.
2Temperature
If curing is performed at low temperatures for electronic components, then component reliability is maintained, but curing time increases
Solution Approach 1:
The patent selects specific parameter ranges for the 2-methylene-1,3-dicarbonyl compound (molecular weight 180-10,000) and the basic substance (pKa ≥ 8) to optimize the curing reaction kinetics. This enables effective curing at low temperatures (including room temperature) while maintaining reasonable curing times suitable for electronic component assembly.
Solution Approach 2:
The patent uses a proven chemical system (2-methylene-1,3-dicarbonyl compound with basic substance) that has demonstrated effective low-temperature curing performance. This established system is copied and applied to electronic component encapsulation, ensuring reliable low-temperature curing without requiring new development.
3Speed
If 2-methylene-1,3-dicarbonyl compounds with low molecular weight are used, then reactivity is improved, but outgassing and bleeding occur
Solution Approach 1:
The patent specifies an optimal molecular weight range (180-10,000) for the 2-methylene-1,3-dicarbonyl compound that balances reactivity and outgassing prevention. This parameter optimization ensures sufficient curing speed while eliminating the outgassing and bleeding problems associated with low molecular weight compounds.
Solution Approach 2:
The patent requires the presence of a specific structural unit within the 2-methylene-1,3-dicarbonyl compound that provides localized functional properties. This structural requirement ensures high reactivity at the reaction site while the overall molecular weight control prevents outgassing and bleeding in the bulk material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables convenient and effective curing of a base resin at low temperatures, maintaining desired physical properties and preventing outgassing and bleeding, even with slight deviations in mixing ratios, making it suitable for electronic component assembly.
Implementation Method 1
a curing reaction proceeds in a short period of time, resulting in solidification
Implementation Method 2
a polymerization system comprising a diethyl methylene malonate monomer (DEMM) and a polymerization activator
Data Source
AI summary
It is an object of the present invention to provide a curing agent composition capable of curing, without inconvenience, a base resin containing a 2-methylene-1,3-dicarbonyl compound, and a two-part mixing adhesive and the like containing the same. The present invention provides a curing agent composition containing a specific 2-methylene-1,3-dicarbonyl compound and an initiator; a two-part mixing adhesive formed of the same and a base resin containing another specific 2-methylene-1,3-dicarbonyl compound; and a method for curing another specific 2-methylene-1,3-dicarbonyl compound using the same.