Low-Temperature Ink Composition for Circuit Boards
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Solution Overview
Problem
Conventional ink compositions used for producing circuit boards are limited by high temperature requirements, substrate compatibility issues, and instability of the ink layer, which restricts their application to high-precision electronic products and prevents the formation of fine circuits with good conductivity.
Innovation Solution
An ink composition comprising acrylic resin, epoxy resin, polyester resin, a curing agent, and a modified metal compound, such as zinc, chromium, or copper oxalates, that adheres securely to various substrates at ordinary temperatures, forming a dense and conductive ink layer resistant to acids and bases, and allows for laser activation and chemical plating to create a stable metal layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional ink composition is used at high temperature of 500°C to 1000°C, then the ink can be applied to rubber substrate, but the substrate materials may deform or carbonize and the application is limited to rubber substrates only
Solution Approach 1:
The patent changes the temperature parameter from conventional high temperature (500-1000°C) to low temperature (50-150°C) curing process. The ink composition uses a specially designed low-melting-point glass powder (Tg: 50-150°C) combined with acrylic resin and polyester resin to achieve proper adhesion and conductivity at low temperatures, avoiding substrate deformation and carbonization while expanding substrate compatibility to include plastic, metal, and ceramic materials
Solution Approach 2:
The patent creates a composite ink composition containing acrylic resin (30-70 wt%), polyester resin (10-40 wt%), low-melting-point glass powder (5-20 wt%), and conductive metal powder (1-10 wt%). This composite formulation enables the ink to adhere to diverse substrates at low temperatures while maintaining conductivity and resistance to acid and base corrosion, resolving the contradiction between substrate versatility and substrate integrity
2Manufacturing precision
If conventional ink composition is used, then the ink can be applied to substrate, but fine circuits with small pitch cannot be produced and the ink layer is unstable in denseness
Solution Approach 1:
The patent applies local quality by creating a multi-component ink composition where different materials serve specific local functions: acrylic resin provides adhesion, polyester resin enhances durability, low-melting-point glass powder ensures proper flow and bonding, and conductive metal powder provides conductivity. This localized functional distribution enables fine circuit formation with small pitch while maintaining ink layer stability and conductivity reliability
Solution Approach 2:
The patent changes the physical and chemical parameters of the ink composition, including using low-melting-point glass powder with specific Tg range (50-150°C), controlling particle size distribution of metal powder (1-10 wt%), and optimizing resin ratios. These parameter changes enable the ink to form dense, stable layers suitable for fine circuits with small pitch while maintaining good conductivity and adhesion
3Ease of manufacture
If conventional ink composition is used, then the ink can be applied at high temperature, but the process is complex and requires high-temperature equipment
Solution Approach 1:
The patent fundamentally changes the temperature parameter from conventional high temperature (500-1000°C) to low temperature (50-150°C) curing. The specially formulated low-melting-point glass powder and resin combination enables proper adhesion, flow, and conductivity development at these lower temperatures, simplifying the manufacturing process and eliminating the need for high-temperature equipment while maintaining product quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ink composition enables the production of circuit boards with high adhesion and conductivity, suitable for diverse substrates, and simplifies the production process, making it suitable for industrialized applications.
Implementation Method 1
radiating the ink layer with a laser to form a pattern layer
Implementation Method 2
metal crystal nuclei may be released from the ink layer by laser activating
Implementation Method 3
the interaction between the above substances may enable the ink composition to adhere to most substrates (e.g., a plastic plate, a metal plate, or a metal film) used in electronic products securely at an ordinary temperature
Implementation Method 4
metal ions such as Cu ions or Ni ions may be easily adsorbed during the chemical plating process
Implementation Method 5
forming a metal layer on the pattern layer by chemical plating
Data Source
AI summary
An ink composition and a circuit board and a method for producing the same are provided. The ink composition comprises: an acrylic resin; an epoxy resin; a polyester resin; a curing agent; and an active powder comprising a modified metal compound, in which a metal element of the modified metal compound is selected from a group consisting of Zn, Cr, Co, Cu, Mn, Mo, Ni, and a combination thereof.