Low Temperature Curable Polyimide Resin via Catalyst
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for preparing polyimide resins require high temperature curing processes, which are inefficient and can't be used for heat-sensitive processes, and often leave residual solvents, limiting their application in electronic materials.
Innovation Solution
A method using a low boiling point solvent and catalyst to polymerize polyimide resins at lower temperatures (120° C to 200° C), eliminating the need for high temperature curing and reducing solvent residues, allowing for the production of polyimide resins with excellent mechanical strength and processability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high temperature curing process is used to prepare polyimide resin, then complete imidization and curing is achieved, but equipment damage occurs and heat-sensitive processes cannot be used
Solution Approach 1:
The invention changes the temperature parameter from conventional high temperature (300°C or higher) to low temperature (80°C to 200°C) by introducing a catalyst and specific solvent system, achieving complete imidization without equipment damage
Solution Approach 2:
A catalyst (such as triethylamine, pyridine, or DMAP) is introduced as an intermediary substance to facilitate the imidization reaction at lower temperatures, enabling the transformation without direct high-temperature treatment
2Reliability
If high temperature thermal treatment is performed to prepare polyimide resin, then curing is achieved, but large-scale heat equipment is required reducing production efficiency
Solution Approach 1:
By changing the temperature parameter to low temperature range and using catalysts, the invention eliminates the need for large-scale heat equipment, enabling use of conventional coating and drying equipment, thus improving production efficiency
3Reliability
If conventional polyimide precursor solution is used, then good polarization characteristics and insulation are achieved, but high temperature curing is required which limits application
Solution Approach 1:
The invention changes the curing temperature parameter to low temperature range, making polyimide resin compatible with heat-sensitive processes while maintaining excellent insulation characteristics and electrical properties
Solution Approach 2:
Catalysts are used as intermediaries to enable low-temperature curing, expanding the applicability of polyimide resin to heat-sensitive substrates and processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of polyimide resins that are curable at lower temperatures, minimizing equipment damage and enhancing production efficiency, with the resulting resin being suitable for electronic materials, photosensitive compositions, and ink compositions for printing.
Implementation Method 1
polymerizing a polyimide resin using a solvent having a low boiling point ranging from 130° C. to 180° C.
Implementation Method 2
adding an amine-based catalyst having a low boiling point and high reactivity along with the low boiling point solvent in the preparation process of polyimide
Data Source
AI summary
In a method for preparing a polyimide resin by reacting diamine and dianhydride, the polyimide resin is polymerized under the presence of a solvent having a boiling point ranging from 130° C. to 180° C. so as to be curable at a low temperature ranging from 150° C. to 250° C. Because the polyimide is curable even at a low temperature, when the polyimide resin is used as an electronic material, damage to equipment due to an otherwise high temperature process can be minimized, and in addition, the polyimide resin can be extensively used as an electronic material such as for a plastic substrate, or the like.