Low-Temperature Curable Resin Composition With Long Pot Life
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Solution Overview
Problem
Existing resin compositions face challenges in curing at high temperatures, leading to member damage and require a long pot life for effective use in joining applications, particularly in IoT devices like smartphones.
Innovation Solution
A resin composition comprising a radically polymerizable curable resin, an organic peroxide, a polymerization inhibitor with sublimability, and optionally electrically conductive particles, allowing for curing at low temperatures (e.g., 80°C or less) with a prolonged pot life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high temperature curing is used to achieve strong adhesion, then bonding strength is improved, but member damage occurs and reliability deteriorates
Solution Approach 1:
The patent changes the temperature parameter from conventional high temperature (180°C or higher) to low temperature (100°C or lower) curing. This is achieved by selecting specific peroxide initiators with appropriate decomposition characteristics and controlling the curing process temperature to prevent member damage while achieving sufficient bonding strength through extended curing time at low temperature
Solution Approach 2:
The patent applies preliminary action by using a polymerization inhibitor to prevent premature polymerization during storage and handling. The inhibitor maintains the adhesive in a stable, non-reactive state until application, ensuring the adhesive remains usable throughout the pot life period without unintended curing that would compromise the bonding process
2Object-affected harmful factors
If low temperature curing is used to prevent member damage, then reliability is improved, but curing speed decreases and productivity deteriorates
Solution Approach 1:
The patent employs periodic action through extended low-temperature curing processes. Instead of rapid high-temperature curing, the adhesive cures gradually over an extended period at low temperature (100°C or lower), allowing the polymerization to proceed slowly and completely, achieving both member protection and sufficient curing through time-based periodic exposure to the curing conditions
Solution Approach 2:
The patent changes multiple parameters simultaneously: lowering temperature from 180°C to 100°C or lower, extending curing time, and selecting specific peroxide initiators with appropriate half-life characteristics at low temperatures. This multi-parameter optimization enables slow but complete curing that prevents member damage while ultimately achieving full bonding strength
3Ease of operation
If extended pot life is used to allow adequate working time, then ease of operation is improved, but polymerization stability deteriorates
Solution Approach 1:
The patent uses a polymerization inhibitor as an intermediary substance that temporarily blocks the polymerization reaction during storage and handling. The inhibitor acts as a mediator between the peroxide initiator and the adhesive components, preventing premature reaction while allowing the adhesive to remain stable throughout the extended pot life period. The inhibitor is consumed or deactivated during the curing process, allowing complete polymerization to proceed
4Duration of action of moving object
If low temperature curing is used to achieve long pot life, then duration of action is improved, but curing completeness worsens
Solution Approach 1:
The patent applies preliminary action by incorporating a polymerization inhibitor that maintains the adhesive in a stable, uncured state during the extended pot life period. This preliminary inhibition prevents any premature polymerization that would reduce pot life, while the inhibitor is designed to be completely consumed or deactivated during the low-temperature curing process, ensuring complete curing and full bonding strength is achieved
Solution Approach 2:
The patent employs periodic action through extended low-temperature curing that allows the polymerization to proceed gradually and completely. The extended time period at low temperature ensures that even with the inhibitor present during storage, the curing process can complete fully without leaving residual uncured material, achieving both long pot life and complete curing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low-temperature curing with a long pot life, producing a cured product suitable for semiconductor devices and electronic components with desired properties such as elasticity and conductivity.
Implementation Method 1
a radically polymerizable curable resin (A) and (B) an organic peroxide
Implementation Method 2
an organic peroxide (B) having a 10-hour half-life temperature of 70° C. or less
Implementation Method 3
a polymerization inhibitor having sublimability (C)
Data Source
AI summary
A resin composition that can cure at a relatively low temperature and has a long pot life, a cured product, and a semiconductor device and an electronic component including a cured product are provided. The resin composition includes (A) a radically polymerizable curable resin, (B) an organic peroxide, and (C) a polymerization inhibitor having sublimability. The resin composition further includes (D) electrically conductive particles as necessary.