Low Temperature Self-Sealing Vacuum Packaging for MEMS
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Solution Overview
Problem
Conventional vacuum packaging techniques for MEMS devices require high temperatures and mechanical actions, which can cause thermal expansion and mechanical stress, and are not suitable for devices that need to operate in a vacuum environment without these conditions.
Innovation Solution
A low-temperature self-sealing vacuum packaging method using a semi-enclosure with an inlet channel and uncured vacuum sealant, where the sealant is configured to cover the entryway due to pressure differences and cures under vacuum, eliminating the need for high temperatures and mechanical actions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional solder gasket sealing is used, then vacuum sealing is achieved, but high temperatures are required causing thermal expansion
Solution Approach 1:
The patent changes the sealing mechanism from thermal (solder melting) to pressure-driven (vacuum pressure moving the sealant). The uncured sealant material is driven by pressure differential to seal the entryway, eliminating the need for high temperatures and thermal expansion
Solution Approach 2:
The patent replaces the mechanical soldering process with a pressure-driven fluid dynamics system. The uncured sealant acts as a pressure-responsive material that automatically seals when vacuum pressure is applied, substituting thermal-mechanical soldering with pressure-fluid sealing
2Reliability
If conventional solder gasket sealing is used, then vacuum sealing is achieved, but mechanical devices are required to lower the lid
Solution Approach 1:
The uncured sealant material serves as a self-actuating component that automatically seals the entryway when vacuum pressure is applied. The system uses the vacuum pressure itself to drive the sealing action, eliminating the need for separate mechanical devices to manipulate the lid or sealant
Solution Approach 2:
The uncured sealant acts as an intermediary material between the vacuum pressure and the sealing function. It translates the vacuum pressure differential into the sealing action, eliminating the need for direct mechanical intervention
3Temperature
If uncured sealant is used to cover entryway, then low temperature sealing is achieved, but pressure differential control is required
Solution Approach 1:
The patent uses the pressure differential as a controllable parameter to drive the sealing process. By controlling the vacuum pressure level, the system can precisely control when and how the uncured sealant moves to seal the entryway, transforming pressure from a challenge into a controllable sealing mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for effective vacuum sealing of MEMS devices and other items at lower temperatures without thermal expansion or mechanical stress, enabling reliable vacuum packaging without high-temperature soldering or mechanical manipulation.
Implementation Method 1
the desired vacuum pressure being configured to cause the uncured entryway vacuum sealant to substantially cover the entryway of the semi-enclosure due to a difference in pressure between the desired vacuum pressure and a vacuum chamber pressure
Implementation Method 2
curing the uncured entryway vacuum sealant under vacuum pressure in the semi-enclosure in the vacuum chamber
Data Source
AI summary
A method and system involves vacuum sealing a semi-enclosure at room temperature without requiring mechanical actions within the vacuum chamber. The semi-enclosure has an inlet channel that extends inwardly into the vacuum chamber from an exterior opening (entryway) into the semi-enclosure. An uncured entryway vacuum sealant is provided at the entryway for the semi-enclosure. A vacuum is established in the vacuum chamber until the vacuum pressure reaches a desired vacuum pressure that causes the uncured entryway sealant to be provided to the entryway for the semi-enclosure. The uncured entryway vacuum sealant is cured under vacuum pressure in the semi-enclosure in the vacuum chamber.