Low Thermal Resistance Cooler Module for Embedded Systems
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Solution Overview
Problem
Conventional cooler modules for embedded systems experience increased thermal resistance due to the arrangement of compression springs, which hinders efficient heat transfer and structural stability, and complicates installation.
Innovation Solution
A low thermal resistance cooler module design featuring a heat-transfer base member with recesses and elongated, curved grooves for flat heat pipes, a heat-transfer block with phase change material, and connection plates for direct contact with heat sources, minimizing vertical thickness and facilitating even pressure distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If compression springs are arranged between the metal blocks and the flat base member to support the metal blocks, then the metal blocks can be kept in contact with heat sources, but the thermal resistance increases and heat transfer efficiency decreases
Solution Approach 1:
The invention removes the compression springs from the heat transfer path between the metal blocks and the heat sources. By eliminating this intermediate component, the direct contact between metal blocks and heat sources is achieved, thereby reducing thermal resistance and improving heat transfer efficiency while maintaining contact stability through alternative means.
Solution Approach 2:
The invention introduces a heat transfer plate as an intermediary between the metal blocks and the heat sources. This plate provides a large contact area that ensures stable contact and even pressure distribution while maintaining efficient thermal conduction, replacing the function of compression springs without the thermal resistance penalty.
2Adaptability or versatility
If the thickness of the heat-transfer plate is increased to fit different heat sources, then adaptability improves, but the thermal resistance increases
Solution Approach 1:
The invention divides the heat transfer function into multiple components: the heat transfer base member with recesses, flat heat pipes, metal blocks, and heat transfer plates. This segmentation allows each component to be optimized independently - the heat transfer plates can be thin for low thermal resistance while the recesses and modular components provide adaptability to different heat sources.
Solution Approach 2:
The invention creates different local structures for different functions: thin heat transfer plates for efficient heat conduction where thermal resistance matters, and recesses with compression springs for adaptability and contact pressure where mechanical accommodation is needed. Each local area is optimized for its specific function.
3Reliability
If compression springs are used to support metal blocks, then contact with heat sources is maintained, but pressure distribution becomes uneven causing metal block surface damage
Solution Approach 1:
The invention uses curved or arc-shaped contact surfaces between the metal blocks and heat transfer plates, which distribute contact pressure more evenly across the surface compared to flat contact. This curvature allows for better pressure distribution that maintains contact while preventing localized stress concentration and surface damage.
4Stability of the object's composition
If compression springs are installed between the metal blocks and flat base member, then the structure is stabilized, but installation becomes difficult due to pre-compression requirements
Solution Approach 1:
The invention pre-configures the heat transfer base member with recesses that accommodate the compression springs and flat heat pipes in their proper positions and pre-compression states before final assembly. This preliminary arrangement of components in the base member eliminates the need for difficult field installation of pre-compressed springs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency by maintaining direct contact with heat sources, reduces thermal resistance, and simplifies installation while maintaining structural stability and compensating for manufacturing tolerances.
Implementation Method 1
facilitating quick dissipation of waste heat through a phase change material and capillary action in flat heat pipes
Implementation Method 2
facilitating quick dissipation of waste heat through a phase change material
Implementation Method 3
enables a heat-transfer block to be positively kept in contact with a heat source of a circuit board in an embedded system to evenly distribute the bearing pressure, reducing thermal resistance and facilitating quick dissipation of waste heat
Data Source
AI summary
A low thermal resistance cooler module includes a heat-transfer base member defining a recess and multiple elongated, curved locating grooves, flat heat pipes set in the elongated, curved locating grooves with respective hot interfaces thereof suspending in the recess and respective cold interfaces thereof bonded to the heat-transfer base member, a heat-transfer block fixedly mounted with the hot interfaces of the flat heat pipes in the recess of the heat-transfer base member for transferring waste heat from a heat source of an external circuit board by direct contact, and connection plates respectively connected between the heat-transfer block and the heat-transfer base member.