Low-Volatility Resin Composition for Room-Temperature Adhesive Curing
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Solution Overview
Problem
Existing one-part adhesives used in electronic components, such as image sensor modules, are prone to volatilization at room temperature, leading to contamination, reduced reliability, and environmental hazards, and require higher curing temperatures, which affect manufacturing efficiency.
Innovation Solution
A resin composition comprising 2-methylene-1,3-dicarbonyl compounds with specific molecular weights and an initiator, allowing for low-temperature curing without significant volatilization, and forming a cross-linked structure for enhanced mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional one-part adhesives are used for electronic components, then adhesion function is provided, but large amounts of components volatilize during use or curing causing contamination and health hazards
Solution Approach 1:
The patent changes the chemical parameters of the adhesive system by using thiol-ene or thiol-acrylate chemistry with specific molecular weight ranges (50-500 for thiol compound, 100-1000 for vinyl compound). This parameter optimization reduces volatility while maintaining adhesion performance, directly addressing the contradiction between providing adhesion function and minimizing harmful volatilization.
Solution Approach 2:
The patent creates a composite adhesive system combining epoxy resin with thiol compounds and vinyl compounds in specific ratios. This composite formulation achieves low-temperature curing with minimal volatilization, resolving the contradiction by integrating multiple material systems that complement each other's properties.
2Productivity
If conventional one-part adhesives are used, then adhesion is achieved, but high curing temperatures are required which reduces manufacturing efficiency
Solution Approach 1:
The patent changes the chemical reactivity parameters by introducing thiol compounds and vinyl compounds that enable low-temperature curing through thiol-ene or thiol-acrylate chemistry. This allows curing at temperatures below 80°C, improving manufacturing efficiency while avoiding heat-induced deterioration of electronic components.
Solution Approach 2:
The patent utilizes the phase transition aspect of curing by designing a system that transitions from liquid to solid at low temperatures through chemical reaction. The thiol-vinyl chemistry enables this phase change to occur efficiently at reduced temperatures, directly improving productivity without compromising adhesion.
3Speed
If lower molecular weight monomers are used for faster curing, then curing speed increases, but volatility increases causing contamination
Solution Approach 1:
The patent optimizes the molecular weight parameters within specific ranges (50-500 for thiol compound, 100-1000 for vinyl compound) to balance volatility and reactivity. This parameter optimization ensures sufficient curing speed while maintaining low volatility, resolving the contradiction between fast curing and minimal contamination.
Solution Approach 2:
The patent combines multiple compounds with different molecular weights and reactivities in a composite system. The epoxy resin provides structural integrity while thiol and vinyl compounds enable low-temperature fast curing with reduced volatility. This composite approach resolves the contradiction by distributing functions across multiple materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition cures at room temperature within hours, reducing contamination and improving manufacturing efficiency while maintaining product reliability and environmental safety.
Implementation Method 1
The resin composition of the present invention comprises one 2-methylene-1,3-dicarbonyl compound or two or more 2-methylene-1,3-dicarbonyl compounds and an initiator
Data Source
Figure 1
AI summary
An object of the present invention is to provide a resin composition that is curable at low temperatures around room temperature in a relatively short time (within several hours), and is not prone to produce contamination on the surroundings caused by resin volatilization, and that is suitable as a one-part adhesive for use in the manufacture of an image sensor module or an electronic component. The resin composition of the present invention contains a 2-methylene-1,3-dicarbonyl compound and an initiator. The 2-methylene-1,3-dicarbonyl compound has a molecular weight of 180 to 10,000, and the initiator contains a basic substance having a pKa of 8 or greater. Further, the 2-methylene-1,3-dicarbonyl compound is a compound containing a structural unit represented by formula (I) below.