Low-Voltage RF Transceiver Switch Integration for Multi-Mode Paths
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Solution Overview
Problem
Existing RF transceivers for wearable devices face challenges with increased printed circuit board area, power consumption, and manufacturing costs due to the use of external switch devices.
Innovation Solution
Integration of multiple switch configurations within a single integrated circuit for receive and transmit paths, including a low noise amplifier, low power amplifier, and high power amplifier, with switches controlled by a logic circuit to manage power supply voltages and operating modes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an external switch device is used to manage multiple transmit paths, then the transceiver can support multiple frequency bands and communication standards, but the printed circuit board area increases
Solution Approach 1:
The patent integrates multiple switch configurations (first switch for receive path, second switch for first transmit path, third switch for second transmit path) into a single integrated circuit device. This consolidation merges the functionality of what would traditionally require multiple external switch devices, reducing the overall footprint on the printed circuit board while maintaining support for multiple frequency bands and communication standards.
2Adaptability or versatility
If an external switch device is used to manage multiple transmit paths, then the transceiver can support multiple frequency bands and communication standards, but the power consumption increases
Solution Approach 1:
By integrating multiple switch configurations into a single integrated circuit, the patent reduces the total power consumption compared to using multiple separate external switch devices. The integrated architecture allows for more efficient power management and reduces the overhead power consumption associated with multiple independent devices.
3Adaptability or versatility
If an external switch device is used to manage multiple transmit paths, then the transceiver can support multiple frequency bands and communication standards, but the manufacturing costs increase
Solution Approach 1:
The integration of multiple switch configurations into a single integrated circuit device reduces manufacturing costs by eliminating the need to source, assemble, and test multiple separate external switch components. This consolidation simplifies the supply chain and assembly process, making the transceiver more suitable for high-volume production.
4Area of stationary object
If switches are integrated within the same integrated circuit, then the physical space and power requirements are reduced, but the transistor breakdown risk during high power transmit operations increases
Solution Approach 1:
The patent applies different voltage ratings to different switches based on their specific operational requirements. The first switch (for receive path) and third switch (for second transmit path) are configured with voltage ratings suitable for their respective roles, while the second switch (for first transmit path) is specifically designed to withstand higher voltages during high power transmit operations. This localized optimization of component specifications maintains reliability while achieving space and power efficiency.
Data Source
AI summary
A wireless transceiver includes a receive path having a first switch and configured to receive an input signal when the first switch is in an open position, a first transmit path having a second switch and configured to provide a first output signal when the second switch is in a closed position and the first switch is in a closed position, and a second transmit path having a third switch and configured to provide a second output signal when the third switch is in a closed position, the first switch is in the closed position, and the second switch is in an open position. The first, second, and third switches are integrated together with the receive path, the first RF transmit path, and the second transmit path within a same integrated circuit.