Lower Electrode Induction Heating for Uniform Substrate Temperature
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Solution Overview
Problem
In plasma processing, the existing technologies face challenges in achieving uniform temperature distribution of substrates due to the occupation of space by power feeding cables and RF cut filters, which also lead to issues with radio-frequency noise interference.
Innovation Solution
A lower electrode mechanism that uses an induction heating mechanism with an induction heating coil and magnetic substance inside an electrostatic chuck, allowing for wireless heating without the need for power feeding cables, thereby reducing space occupation and noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power feeding cables and RF cut filters are used to heat the substrate, then heating function is achieved, but space is occupied and temperature uniformity deteriorates
Solution Approach 1:
The patent replaces the mechanical power feeding cable system with an electromagnetic induction heating system. The induction heating coil generates a magnetic field that induces eddy currents in the substrate, heating it wirelessly without requiring physical cable connections. This substitution eliminates the space occupation issue while maintaining heating functionality.
Solution Approach 2:
The patent introduces an induction heating coil as an intermediary component between the power source and the substrate. The coil converts electrical energy to magnetic field energy, which then induces heating in the substrate without direct physical contact or cable connection. This intermediary mechanism resolves the contradiction by providing heating while occupying minimal space.
2Temperature
If power feeding cables are used to supply power to heating elements, then heating function is achieved, but radio-frequency noise interference increases
Solution Approach 1:
The patent replaces the cable-based power transmission system with an electromagnetic induction system. The induction heating coil is electrically isolated from the substrate, eliminating the pathway for radio-frequency noise to travel through cables and interfere with other equipment. Heating is achieved through magnetic field coupling rather than direct electrical connection.
Solution Approach 2:
The patent extracts and removes the power feeding cables from the system architecture. By eliminating the physical connection between power source and heating element, the source of radio-frequency noise interference is removed entirely, while the heating function is maintained through the induction mechanism.
3Object-affected harmful factors
If multiple RF cut filters are installed to reduce noise, then noise interference is reduced, but device complexity and space occupation increase
Solution Approach 1:
The patent extracts and eliminates the need for RF cut filters by removing the cable-based power transmission system. Since the induction heating coil is electrically isolated from the substrate, there are no cables requiring noise filtering, thus eliminating the complexity and space requirements for multiple RF cut filters.
Solution Approach 2:
The patent replaces the cable-and-filter noise suppression system with an inherently noise-free electromagnetic induction system. The wireless power transmission through magnetic field coupling eliminates the need for physical filters, reducing device complexity while maintaining noise reduction benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient wireless heating of substrates, improving temperature uniformity and reducing the need for multiple RF cut filters, thus optimizing the use of space and minimizing noise interference during plasma processing.
Implementation Method 1
an induction heating mechanism, in which the induction heating mechanism includes an induction heating element heated by an induction magnetic field, and a magnetic field generator that is disposed inside the base portion and generates the induction magnetic field
Implementation Method 2
a magnetic field generator that is disposed inside the base portion and generates the induction magnetic field
Data Source
AI summary
There is provided a lower electrode mechanism for plasma processing, the lower electrode mechanism including: a base portion to which radio-frequency power is applied during the plasma processing; a dielectric portion disposed at an upper surface of the base portion; and an induction heating mechanism, in which the induction heating mechanism includes an induction heating element heated by an induction magnetic field, and a magnetic field generator that is disposed inside the base portion and generates the induction magnetic field.