Power Electronics Lower Module Layout for Straight Air Cooling
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Solution Overview
Problem
Existing power electronic devices face reduced heat dissipation performance and increased size due to the vertical stacking of heat sinks and DC reactors, which limits the extension length of heat dissipation fins and results in branched air flows.
Innovation Solution
A lower module design that positions the DC reactor at the rear side of the heat sink, allowing for a straight air flow path through capacitors, heat sinks, and DC reactors, with extended heat dissipation fins and minimized height, using a blower fan and discharge plate configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the heat sink and DC reactor are disposed in a stacked arrangement in the vertical direction, then the structure can accommodate both components, but the concentration of heat dissipation is reduced as the air is branched and the size H1 in the height direction of the lower module is larger
Solution Approach 1:
The patent repositions the DC reactor from a vertical stacked arrangement to a horizontal arrangement at the rear side of the heat sink. This dimensional change transforms the air flow from a branched vertical path to a straight horizontal path, allowing the air to cool both the heat sink and DC reactor sequentially without branching, thereby improving heat dissipation concentration while reducing the height direction size H1 of the lower module
2Loss of energy
If the heat sink and DC reactor are disposed in a stacked arrangement, then both components can be cooled, but the extension length of the heat dissipation fin is limited and heat dissipation performance is limited
Solution Approach 1:
By changing the spatial arrangement from vertical stacking to horizontal positioning, the patent enables the heat dissipation fins to extend further in the horizontal direction without being constrained by the vertical space occupied by the DC reactor. This increases the extension length of the heat dissipation fins and improves heat dissipation performance
3Loss of energy
If the DC reactor is positioned at the rear side of the heat sink, then a straight air flow is formed improving heat dissipation, but the air flow path length increases
Solution Approach 1:
The patent merges the cooling functions of the heat sink and DC reactor into a single straight air flow path. The air introduced by the blower fan flows horizontally through both components sequentially, combining their heat dissipation into one efficient path rather than requiring separate branched paths, thereby improving heat dissipation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation performance and reduces the overall size of the power electronic device by optimizing air flow and extending heat dissipation fins, while maintaining efficient cooling of components.
Implementation Method 1
in the case of the lower module, a forced cooling system is formed to forcedly suction outside air by installing a blower fan
Implementation Method 2
a heat sink having a plurality of heat dissipation fins through which heat generated from a heating component disposed on the upper module is conducted
Implementation Method 3
cool the plurality of heat dissipation fins by air moved from the plurality of capacitors
Implementation Method 4
the air passes through the blower fan, the plurality of capacitors, the heat sink, the DC reactor, and the discharge plate, in order, to be then discharged to the outside after heat exchange
Data Source
AI summary
A lower module of a power electronic device includes a lower module included in a power electronic device that is divided into an upper module and a lower module by an intermediate plate and comprises a blower fan to introduce air into the inner space of the lower module; a plurality of capacitors installed in a suspended form on the intermediate plate and spaced apart from the blower fan; a heat sink having a plurality of heat dissipation fins through which heat generated from a heating component disposed on the upper module is conducted, and disposed adjacent to the capacitors to cool the plurality of heat dissipation fins by air moved from the plurality of capacitors; a DC reactor cooled by the air moved from the heat dissipation fins; and a discharge plate having a vent hole to discharge the air moved from the DC reactor to the outside.