LS Core LED Connector Metal Wire Frame Thermal Management

The patent employs composite construction by combining metal wire frames (for thermal conduction) with molded plastic structures (for mechanical support and electrical insulation). The metal wire frame acts as a thermal pathway while the plastic provides structural integrity, creating a hybrid solution that leverages the advantages of both materials to simultaneously achieve ease of manufacture and effective heat transfer.

The patent merges the heat dissipation function directly into the mechanical support structure by integrating the metal wire frame that holds the LED chips with the thermal conduction pathway. This eliminates the need for separate heat sink devices, as the same metal structure that provides mechanical support also serves as the thermal conduction medium, thereby reducing device complexity while maintaining heat transfer efficiency.

The patent segments the functional requirements into distinct components: the metal wire frame handles thermal conduction and electrical connection, while the molded plastic structure provides mechanical support and positioning. This segmentation allows each component to be manufactured and assembled separately, reducing the overall manufacturing precision requirements compared to a monolithic PCB structure that must simultaneously fulfill all functions.