LSPR Sensing Chip Nanostructure Spacer and Surface Modification
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Solution Overview
Problem
Current localized surface plasmon resonance (LSPR) chips have lower sensitivity compared to traditional ELISA methods due to difficulties in effectively conjugating analyte molecules onto metal nanostructures, which affects the spectral shift and sensitivity level.
Innovation Solution
A sensing chip with metal nanostructures spaced apart from the substrate and undergoing two-stage surface modification using thiol and silyl group-containing molecules to increase analyte conjugation on effective sensing areas and reduce noise interference, enhancing sensitivity and linear relationship between signal strength and analyte concentrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If metal nanostructures are placed close to the substrate to maximize sensing hot spot, then the spectral shift is enhanced, but the sensitivity level decreases due to inability to effectively conjugate analyte molecules
Solution Approach 1:
The patent introduces a spacer layer between the metal nanostructures and the substrate, transitioning from a zero-dimensional contact interface to a three-dimensional separated structure. This spatial separation moves the sensing hot spot away from the substrate, enabling analyte molecule conjugation while maintaining spectral shift enhancement through optimized metal nanostructure geometry and positioning.
2Reliability
If metal nanostructures are spaced apart from the substrate to enable analyte conjugation, then the sensitivity level increases, but the spectral shift may be reduced
Solution Approach 1:
The patent optimizes multiple parameters including the spacer layer thickness (50-200 nm), metal nanostructure size (20-500 nm), metal material composition (gold, silver, copper), and surface modification chemistry to simultaneously achieve both spectral shift enhancement and sensitivity improvement. The surface modification with thiol and silyl groups further optimizes the interface properties for analyte conjugation.
3Reliability
If surface modification is performed to increase analyte conjugation probability, then the sensitivity level increases, but the device complexity increases
Solution Approach 1:
The patent performs surface modification with thiol and silyl groups before analyte conjugation, preparing the metal nanostructure surface in advance to enhance analyte binding probability. This preliminary surface preparation simplifies the overall process by ensuring optimal conjugation conditions are established beforehand, reducing the need for complex post-conjugation adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases the sensitivity level of the sensing chip by exposing the sensing hot spot and improving analyte molecule conjugation, resulting in a stronger linear relationship between signal strength and analyte concentrations, thereby enhancing the chip's sensitivity and accuracy.
Implementation Method 1
The first surface modified layer is disposed on the surface of the metal nanostructure, wherein the first surface modified layer includes a plurality of thiol group-containing molecules
Implementation Method 2
The second surface modified layer is disposed on the surface of the substrate, wherein the second surface modified layer includes a plurality of silyl group-containing molecules
Implementation Method 3
Localized surface plasmon resonance (LSPR) technology is a testing method without fluorescent labeling
Data Source
AI summary
A sensing chip including a substrate, a plurality of metal nanostructures, a first surface modified layer and a second surface modified layer is provided. The metal nanostructures are disposed on the substrate. The first surface modified layer is disposed on a surface of the metal nanostructures, wherein the first surface modified layer includes a plurality of thiol group-containing molecules. The second surface modified layer is disposed on a surface of the substrate, wherein the second surface modified layer includes a plurality of silyl group-containing molecules.