LTCC Antenna Ceramic Substrate Flatness and Impedance Matching
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Solution Overview
Problem
The challenge is to manufacture a ceramic substrate for 5G antenna modules with improved flatness and impedance matching, as existing methods face issues with heat-related efficiency losses and EMI noise, particularly when scaling up, which affects the compatibility and radiation efficiency of ceramic substrates.
Innovation Solution
A method involving the stacking and compression of LTCC substrates with specific via electrodes for feeding and grounding in a coaxial line structure, followed by calcination, to achieve uniform flatness and enhanced impedance matching, utilizing different materials and structures for the base layers to compensate for shrinkage and expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the ceramic substrate is manufactured to be larger than a certain size, then the area of the substrate is increased, but the flatness of the substrate decreases
Solution Approach 1:
The ceramic substrate is divided into multiple base material layers (first base material layer and second base material layer) that are stacked and compressed separately. Each layer can be manufactured and controlled independently, allowing the overall large area substrate to maintain flatness through layered construction and controlled compression processes.
2Manufacturing precision
If via electrodes for feeding and grounding are implemented in a coaxial line structure, then the impedance matching is improved, but the device complexity increases
Solution Approach 1:
The via electrode for feeding and the via electrode for grounding are merged into a coaxial line structure where the grounding via surrounds the feeding at a predetermined distance. This integration achieves improved impedance matching while maintaining manufacturing feasibility through a unified structural approach rather than separate independent elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures the ceramic substrate has uniform flatness and improved impedance matching, enhancing the radiation efficiency and isolation between power supply circuits, thus addressing the heat and EMI noise issues in 5G antenna modules.
Implementation Method 1
compressing the first and second base material layers
Implementation Method 2
calcinating the compressed first and second base material layers
Data Source
AI summary
A method for manufacturing an antenna module ceramic substrate is provided. Provided is a method for manufacturing an antenna module ceramic substrate, according to one embodiment of the present invention, the method comprising the steps of: stacking a first base material layer and a second base material layer so that each of a radiation pattern formed between the first and second base material layers and a connection pattern formed inside the second base material layer to be electrically connected with the radiation pattern are provided; compressing the first and second base material layers; and calcinating the compressed first and second base material layers.