LTCC Current Sensor Integration for High-Temperature Power Modules
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Solution Overview
Problem
Conventional power modules face challenges with external sensors that are bulkier and less accurate at high temperatures, leading to increased size and cost, as well as reduced precision in monitoring and control.
Innovation Solution
Integration of a low-temperature co-fired ceramic (LTCC)-based current sensor within the power module, designed to operate at high temperatures and maintain precision, featuring a power loop, signal loop, and electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external sensors are used to measure output current, then measurement function is provided, but system size and weight increase
Solution Approach 1:
The patent integrates the current sensor directly into the power module by incorporating a sensing loop within the module's substrate structure. This merging of the sensor function into the existing power module eliminates the need for separate external sensors, thereby providing current measurement capability while avoiding additional weight and size increase.
2Measurement precision
If external sensors are used to measure output current, then measurement function is provided, but system cost increases
Solution Approach 1:
By integrating the sensing loop and sensor circuitry directly into the power module substrate, the invention eliminates the need for separate external sensor components. This integration reduces the total component count, simplifies assembly processes, and lowers overall system cost while maintaining measurement functionality.
3Measurement precision
If conventional sensors are used at high temperatures, then measurement is provided, but measurement accuracy drops
Solution Approach 1:
The patent employs a sensing loop design with specific geometric parameters and material properties that maintain measurement accuracy across high temperature ranges. The loop's configuration and the integrated sensor's characteristics are optimized to compensate for thermal effects, ensuring precise current measurement even at elevated operating temperatures where conventional sensors would fail.
4Power
If power module operates at high temperatures, then power density is enhanced, but sensor accuracy deteriorates
Solution Approach 1:
The integration of the sensing loop directly into the power module substrate allows the sensor to operate in close proximity to the power devices, enabling accurate measurement of high-current, high-power conditions. The merged structure ensures that the sensor experiences the same thermal environment as the power devices, allowing for compensated measurements that maintain accuracy even as power density and temperature increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise monitoring and control at high temperatures, reducing system size and cost by integrating the sensor directly within the power module, enhancing power density and reliability.
Implementation Method 1
an electromagnetic interference shielding layer configured to protect circuitry of the sensor from external electromagnetic radiation
Implementation Method 2
a signal loop configured to sense power from the power loop
Data Source
AI summary
A low-temperature co-fired ceramic (LTCC) current sensor integrated within the power module. The sensor includes a series of individual and stacked sheets, where such sheets may correspond to low-temperature co-fired ceramic sheets. The sensor further includes a power loop configured to provide power to the sensor. The sensor additionally includes a signal loop configured to sense power from the power loop. Furthermore, the sensor includes an electromagnetic interference shielding layer configured to protect circuitry of the sensor from external electromagnetic radiation. Such a sensor is capable of operating at high temperatures of approximately 250° C. Furthermore, since the sensor is designed on a high-temperature substrate material, the sensor is able to be easily integrated inside the power module.