LTCC Substrate Cutting Pattern for Friction Stress Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The high hardness and crumbly nature of low-temperature co-fired ceramics (LTCC) substrates generate significant friction stress during cutting, leading to potential damage and reduced manufacturing yield and increased costs.
Innovation Solution
Incorporating a cutting pattern between substrate units, which can be in the form of grooves or holes, to reduce friction stress and facilitate easier cutting of the LTCC substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the LTCC substrate is cut using a conventional cutting machine, then the substrate can be divided into individual units, but the high hardness and crumbly property generate large friction force and stress that may damage the substrate or cutting blade, reducing manufacturing yield
Solution Approach 1:
The invention applies preliminary action by forming grooves or holes in the LTCC substrate before the cutting process. These pre-formed features reduce the friction stress during cutting, preventing substrate damage and enhancing manufacturing yield. The grooves or holes are created in advance to modify the cutting characteristics and reduce the harmful friction forces that would otherwise occur during the cutting operation.
2Strength
If the LTCC substrate has high hardness for structural strength, then the substrate can maintain its mechanical properties, but the cutting process generates larger friction force requiring larger cutting force that may damage the substrate
Solution Approach 1:
The grooves or holes are formed in advance on the LTCC substrate to create stress relief features that reduce the cutting force required. These pre-formed structures modify the mechanical properties in the cutting zone, allowing the high-hardness substrate to be cut with reduced force while maintaining its overall structural strength.
Solution Approach 2:
The invention applies local quality by creating grooves or holes at specific locations on the substrate surface. These localized features modify the cutting characteristics only in the areas where they are present, reducing friction stress and cutting force requirements without compromising the overall mechanical strength of the high-hardness LTCC substrate.
Data Source
AI summary
A low-temperature co-fired ceramics (LTCC) substrate includes a plurality of substrate units and at least one cutting pattern. The cutting pattern is disposed between neighboring two of the substrate units. A semiconductor package including the LTCC substrate is also disclosed.