LTCC Microwave Filter Assembly With Busbar Grounding
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Solution Overview
Problem
The existing LTCC microwave passive devices face issues with microstrip breakage and disconnection, leading to degradation in performance due to small grounding areas and direct microstrip grounding.
Innovation Solution
Implementing a transfer busbar to connect multiple microstrips to a larger metal isolation plate for grounding, increasing the grounding area and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If microstrips are used for grounding connection, then the device structure is simple, but the grounding area is small and the microstrips are prone to breakage
Solution Approach 1:
Multiple microstrip grounding connections are merged into a single busbar structure. The busbar integrates multiple grounding points into one consolidated component, increasing the overall grounding area while reducing the number of separate microstrip connections that could fail individually.
Solution Approach 2:
The busbar acts as an intermediary between the microstrips and the grounding reference plane. Instead of microstrips directly contacting the grounding plane (which creates small contact areas), the busbar provides a larger intermediate surface that distributes and enhances the grounding connection.
2Reliability
If multiple microstrips are used for grounding, then each resonance unit can be grounded independently, but the quantity of microstrips increases and complexity increases
Solution Approach 1:
Multiple separate microstrip grounding structures are merged into a single busbar component. This consolidation reduces the total number of discrete grounding elements while maintaining the ability to ground multiple resonance units, thereby reducing structural complexity.
Solution Approach 2:
The busbar serves multiple functions simultaneously: it provides grounding connections for multiple resonance units, increases overall grounding area, and acts as a structural support element. This multi-functionality reduces the need for separate dedicated grounding structures for each resonance unit.
Data Source
AI summary
Embodiments of this application provide an LTCC microwave passive device. The LTCC microwave passive device includes a housing and a filter assembly. The housing includes a top portion, a bottom portion, and a side portion. The filter assembly is accommodated in the housing, and the filter assembly includes a first layer, a second layer, and a third layer. The first layer, the second layer, and the third layer are spaced apart sequentially in a direction from the top portion to the bottom portion, the first layer and the third layer are located on two opposite sides of the second layer respectively, the first layer includes at least two resonance units, each resonance unit includes a microstrip, the second layer includes a transfer busbar, and the microstrip of the resonance unit is connected to the transfer busbar through a corresponding first connection column and is grounded through the transfer busbar.