Sensor Module with LTCC Substrate and Metal Shield for EMI Immunity
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Solution Overview
Problem
Conventional packaged sensor modules for vehicle crash detection systems face issues with size, flexibility, and electromagnetic interference due to the use of alumina-based substrates, which are costly and difficult to shield effectively.
Innovation Solution
A compact sensor module utilizing a low temperature co-fired ceramic substrate with integrated sensors and signal processing circuitry, encapsulated in a metal shield to minimize electromagnetic interference and reduce size, allowing for efficient mounting and accurate signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If alumina-based substrate is used for sensor module, then cost is reduced, but electromagnetic interference protection is insufficient and area is large
Solution Approach 1:
The patent uses a composite structure combining alumina substrate with metal shielding elements. The alumina substrate provides cost-effectiveness and electrical insulation, while integrated metal shields (cans or enclosures) provide electromagnetic interference protection. This composite approach allows the sensor module to achieve both cost reduction and EMI immunity simultaneously.
2Ease of manufacture
If alumina-based substrate is used for sensor module, then cost is reduced, but substrate area becomes large requiring multiple mounting bolts
Solution Approach 1:
The patent transitions from a planar alumina substrate mounting approach to a three-dimensional compact module design. By stacking components vertically and using metal shielding enclosures, the sensor module achieves high resonant frequency and structural rigidity without requiring large substrate area or multiple mounting bolts, thus reducing both area and complexity while maintaining cost-effectiveness.
3Ease of manufacture
If conventional packaging is used, then individual sensors are packaged, but flexibility is limited and room to add second sensing technology is insufficient
Solution Approach 1:
The patent creates a universal sensor module platform that can accommodate multiple sensing technologies (pressure sensors, accelerometers, and potentially other sensors) within a single integrated housing. The metal shielded enclosure and standardized mounting design allow flexible configuration of different sensor types without requiring separate packaging solutions, thereby enhancing adaptability and versatility.
4Measurement precision
If housing is made rigid to transmit crash signals accurately, then signal transmission is improved, but resonant frequency decreases causing signal distortion
Solution Approach 1:
The patent optimizes the structural parameters of the housing and mounting system to achieve the desired balance. By carefully selecting material properties, thickness, and geometric dimensions of the housing walls and mounting features, the design maintains sufficient rigidity for accurate crash signal transmission while keeping the resonant frequency above the expected crash signal frequency range, thereby avoiding signal distortion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective, compact, and EMI-immune sensor module capable of accurately sensing pressure and acceleration, requiring fewer mounting bolts and maintaining high resonant frequency, thus enhancing crash signal integrity.
Implementation Method 1
a low temperature co-fired ceramic substrate located on the housing
Implementation Method 2
a metal shield substantially encapsulating the sensor
Data Source
AI summary
A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.