LTPS Array Substrate Via Structure to Cut Photomask Count
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Solution Overview
Problem
Current LTPS array technology requires a large number of photomasks, leading to longer production cycles, increased costs, and reduced market competitiveness.
Innovation Solution
The proposed array substrate structure includes a substrate, an array layer, an inorganic insulation layer, a conductive electrode, a passivation layer, and a pixel electrode, where a first via hole penetrates the passivation and inorganic insulation layers to connect the pixel electrode to the drain electrode, reducing the need for separate openings and photomasks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional LTPS array technology uses more than 10 photomasks, then manufacturing precision can be maintained, but production cycles become longer and costs increase
Solution Approach 1:
The patent merges the planarization layer and passivation layer into a single integrated structure. The inorganic insulation layer serves dual functions as both planarization and passivation, eliminating the need for separate layers and reducing the number of photomasks required from over 10 to a smaller number, thus shortening production cycles while maintaining manufacturing precision
Solution Approach 2:
The inorganic insulation layer is designed to perform multiple functions simultaneously: it acts as a planarization layer for surface flatness, a passivation layer for protecting underlying structures, and an insulation layer for electrical isolation. This multi-functionality reduces the overall layer count and photomask requirements, improving productivity without sacrificing device complexity control
2Ease of manufacture
If traditional LTPS array technology uses more than 10 photomasks, then manufacturing precision can be maintained, but production costs increase
Solution Approach 1:
By combining the planarization and passivation functions into a single inorganic insulation layer, the patent reduces the total number of photomasks from over 10 to a smaller number. This merging of functions directly lowers manufacturing costs by reducing material consumption, process steps, and equipment usage while maintaining the necessary manufacturing precision
Solution Approach 2:
The patent extracts and eliminates redundant layers from the traditional multi-layer structure. By removing the separate planarization organic layer and integrating its function into the inorganic insulation layer, the design reduces the overall layer count and associated photomask requirements, thereby reducing manufacturing complexity and cost
Data Source
AI summary
An array substrate and a display panel are provided. The array substrate includes a substrate, an array layer, an inorganic insulation layer, a conductive electrode, a passivation layer, and a pixel electrode disposed in sequence. The array layer includes a source electrode and a drain electrode. A first via hole is defined in the array substrate. The first via hole penetrates the passivation layer and the inorganic insulation layer and exposes the drain electrode. The pixel electrode is connected to the drain electrode in the first via hole.