Luminescent Body Two-Phase Cooling Device Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing systems with luminescent bodies and two-phase cooling devices face challenges in efficiently managing heat transfer, particularly when high power is required, as they are thermally limited, leading to restricted operational power and mechanical stress issues.
Innovation Solution
A system comprising a luminescent body thermally coupled to a two-phase cooling device with a tapering section and a contact region of reduced thickness (0.15-0.35 mm), which enhances heat transfer by minimizing temperature differences and mechanical stress, while maintaining mechanical integrity through a thicker section for stress tolerance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the device wall thickness is increased to withstand mechanical stresses, then mechanical strength is improved, but heat transfer efficiency deteriorates due to larger temperature differences
Solution Approach 1:
The device wall is designed with non-uniform thickness: a first section with thickness of 0.15-0.35 mm at the contact region for optimal heat transfer, and a second section with greater thickness for mechanical strength. This local differentiation allows each region to fulfill its primary function without compromising the other.
Solution Approach 2:
The device wall is divided into two distinct sections: a first section in contact with the heat source optimized for thermal conductivity, and a second section providing structural support. This segmentation allows independent optimization of thermal and mechanical properties in different regions.
2Temperature
If the device wall thickness is decreased to improve heat transfer, then heat transfer efficiency is improved, but mechanical strength deteriorates
Solution Approach 1:
The device wall is designed with non-uniform thickness: a first section with thickness of 0.15-0.35 mm at the contact region for optimal heat transfer, and a second section with greater thickness for mechanical strength. This local differentiation allows each region to fulfill its primary function without compromising the other.
Solution Approach 2:
The device wall is divided into two distinct sections: a first section in contact with the heat source optimized for thermal conductivity, and a second section providing structural support. This segmentation allows independent optimization of thermal and mechanical properties in different regions.
3Power
If high power operation is implemented, then brightness and power output are improved, but heat generation increases leading to thermal limitations
Solution Approach 1:
The device wall thickness parameter is optimized to 0.15-0.35 mm at the contact region to maximize thermal conductivity and minimize temperature rise, enabling the system to operate at higher power levels without exceeding thermal limits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat transfer efficiency, allowing the luminescent body to operate at higher power densities with reduced mechanical stress and increased brightness, while maintaining the two-phase cooling device within safe stress limits.
Implementation Method 1
a cooling liquid may turn into vapor by absorbing heat at a heat source
Implementation Method 2
the vapor may condense to a liquid and release latent heat
Implementation Method 3
the vapor may condense to a liquid and release latent heat
Implementation Method 4
phase transition between evaporation and condensation
Implementation Method 5
thermal conductivity and phase transition heat transfer mechanism
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 2A~2D
AI summary
The invention provides a system (1000) comprising (i) a luminescent body (200) and (ii) a two-phase cooling device (400), wherein the two-phase cooling device (400) has a device wall (410), wherein the device wall (410) defines an chamber (450), wherein the device wall (410) comprises a tapering section (405) comprising a contact region (406), wherein the tapering section (405) tapers to the contact region (406), wherein the luminescent 5 body (200) is thermally coupled to the contact region (406), and wherein the device wall (410) has a first thickness d1 at the contact region (406), wherein d1 is selected from the range of 0.15 – 0.35 mm.