M-Shaped Conductive Clip for Semiconductor Package Interconnects
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Solution Overview
Problem
Existing semiconductor package technologies using aluminum wiring for connecting dies, such as IGBTs and rectifiers, face limitations including localized current flow, reliability issues due to wire bond cracking, and restricted high current capability.
Innovation Solution
An electrically conductive M-shaped clip is used to connect dies and an emitter structure within a semiconductor package, made from materials like copper or aluminum alloys, directly through bonding materials like solder paste, providing a rigid and efficient current path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If aluminum wiring is used to connect dies, then the connection is established, but localized current flow and wire bond cracking occur reducing reliability
Solution Approach 1:
The patent extracts the problematic wire bonding method and replaces it with a direct clip connection to the emitter structure. By removing the intermediate wire bonds that crack and cause localized heating, the invention directly connects the collector die to the emitter, eliminating the source of reliability issues while maintaining electrical connection functionality.
Solution Approach 2:
The patent introduces an electrically conductive clip as a new intermediary component that connects the collector die directly to the emitter structure. This clip serves as a more reliable mediator than traditional wire bonds, providing a rigid mechanical and electrical connection that distributes current flow evenly and prevents the cracking issues associated with wire bonding.
2Power
If wire bonding is used to connect dies, then connections are established, but high current capability is restricted
Solution Approach 1:
The patent merges the mechanical support function and electrical conduction function into a single integrated clip structure. By combining these functions that were previously separated (wire bonds for electrical connection, separate mounting for mechanical support), the invention achieves higher current capability through a unified rigid connection that can handle both mechanical and electrical demands simultaneously.
Solution Approach 2:
The patent employs an M-shaped clip with curved geometry that optimizes the electrical and mechanical connection. The curved shape allows the clip to conform to the emitter structure and distribute contact pressure evenly, improving current flow characteristics and enabling higher current capability compared to straight wire bonds.
3Temperature
If aluminum wiring is used for connecting dies, then the connection process is established, but thermal management is insufficient
Solution Approach 1:
The patent removes the wire bonding method that creates thermal resistance and localized heating. By extracting the problematic intermediate connection layer, the invention establishes direct thermal contact between the collector die and emitter structure through the rigid clip, enabling more efficient heat dissipation and preventing hotspot formation.
Solution Approach 2:
The patent utilizes an electrically conductive clip made from materials that provide both electrical conductivity and thermal conduction. This composite approach allows the same component to simultaneously manage electrical current flow and thermal dissipation, improving overall thermal management and reducing hotspot risks compared to traditional aluminum wiring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The M-shaped clip ensures better current flow, reduces the risk of hotspots, and enhances reliability by eliminating wire bond limitations, allowing for higher current capability and improved thermal management.
Implementation Method 1
The first end may be configured to couple to a first die through a bonding material. The second end may be configured to couple to a second die through a bonding material. The bonding material may be selected from the group consisting of a solder paste, a solder wire, a preform solder
Data Source
AI summary
Implementations of a clip for a semiconductor package may include: an electrically conductive clip having a first end and a second end and a middle section between the first end and the second end. The first end may be configured to couple to a first die through a bonding material. The second end may be configured to couple to a second die through a bonding material. The middle section may be configured to couple to an emitter structure through a bonding material. The clip may include an integrally formed electrically conductive material and include an M-shape. A middle of the M-shape may be coupled to the emitter structure.