M.2 Expansion Card Heat Dissipation Assembly

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Solution Overview

Problem

The increasing demand for high-speed signal delivery in electronic devices, particularly between the PCI-E interface and the CPU, complicates the wiring layout due to the need for multiple screw holes to fix M.2 expansion cards of varying sizes, making it difficult to manage the wiring configuration on motherboards.

Innovation Solution

A heat dissipating assembly for M.2 expansion cards that includes a heat dissipating body with screw holes and a locking member, allowing for the fixation of M.2 expansion cards using a single M.2 fixing hole on the motherboard, thereby reducing the complexity of wiring and providing a flexible layout.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple screw holes are provided on the motherboard to fix M.2 expansion cards of different sizes, then the expansion cards can be securely fixed, but the wiring layout between PCI-E interface and CPU becomes more difficult

Engineering Contradiction:
Improvefixing reliabilityVSAvoidwiring layout complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The fixing function is segmented from the motherboard to a separate heat dissipating assembly. This assembly includes multiple screw holes for securing M.2 expansion cards and acts as an independent module that can be attached to the motherboard through a single fixing hole, thereby separating the fixing requirements from the wiring layout on the motherboard.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat dissipating assembly serves as an intermediary between the motherboard and the M.2 expansion card. It provides the necessary multiple screw holes for secure fixation while requiring only a single attachment point to the motherboard, thus mediating between the conflicting requirements of secure fixing and simple wiring layout.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If multiple screw holes are provided on the motherboard for fixing M.2 expansion cards, then various sizes of expansion cards can be accommodated, but the number of components and structural complexity increases

Engineering Contradiction:
Improveadaptability to different M.2 card sizesVSAvoidnumber of screw holes and fixing structures
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The heat dissipating assembly is designed as a universal component that can accommodate M.2 expansion cards of various sizes (2230, 2242, 2260, 2280). It integrates multiple screw holes and fixing mechanisms into a single multi-functional module that attaches to the motherboard through one hole, providing versatile support without increasing overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The heat dissipating assembly merges multiple functions into a single component: it provides thermal management, structural support, and secure fixation for M.2 expansion cards. By combining these functions, the design eliminates the need for separate fixing structures on the motherboard, reducing the total number of components.

Inventive Principle:
Principle #5Merging (Combining)

3Device complexity

If a single M.2 fixing hole is used on the motherboard, then wiring layout is simplified, but the ability to securely fix expansion cards of different sizes is reduced

Engineering Contradiction:
Improvewiring layout simplicityVSAvoidsecuring capability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The solution moves the multiple screw holes from the two-dimensional plane of the motherboard to a separate three-dimensional heat dissipating assembly. This dimensional transition allows the assembly to provide multiple fixation points while requiring only a single attachment point to the motherboard, maintaining securing capability without complicating the motherboard's wiring layout.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11191149B2Heat dissipation assembly of M.2 expansion card and electronic device
Publication Date: 2021.11.30 GIGA BYTE TECH CO LTD
  • US11191149B2 patent drawing
  • US11191149B2 patent drawing
  • US11191149B2 patent drawing

AI summary

A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.