Leaf Spring Retention Mechanism for M.2 Heatsink Thermal Contact
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Solution Overview
Problem
Existing solutions for securing M.2 cards in heatsink assemblies face issues with high thermal resistance and inadequate contact, leading to poor heat dissipation and power density limitations, and individual clips often fail due to deformation and loosening over time.
Innovation Solution
A tool-free retention mechanism using leaf springs and a retention carrier with a C-shaped slot and protruding lips to securely position M.2 cards, allowing for high-performance thermal interface material application and maintaining consistent contact force, thereby enhancing thermal efficiency and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual clips are used to retain M.2 cards, then assembly is simple, but the clips deform and loosen over time, leading to poor contact and high thermal resistance
Solution Approach 1:
The patent employs spring-loaded retention clips that are elastically deformable, allowing them to dynamically adapt to thermal expansion and mechanical stresses. The springs maintain constant contact force on the M.2 card and heatsink assembly throughout operational temperature cycles, preventing loosening and ensuring consistent thermal contact over the service life.
Solution Approach 2:
The retention mechanism incorporates compliant elements and damping features that anticipate and absorb thermal expansion, vibration, and mechanical shocks before they can cause loosening or damage. This preemptive cushioning protects the contact interfaces from degradation during normal operation and thermal cycling.
2Temperature
If thermal gap pads are used to position M.2 cards, then assembly is easy, but thermal resistance is high and heat dissipation is poor
Solution Approach 1:
The patent removes thermal gap pads entirely from the design, replacing them with direct mechanical contact between the heatsink and M.2 card through spring-loaded clips. This extraction eliminates the thermal resistance introduced by gap pads while maintaining proper positioning and contact through the elastic retention mechanism.
Solution Approach 2:
The retention clips are constructed from composite or multi-material structures that simultaneously provide mechanical retention force and thermal conduction pathways. This allows the retention mechanism to serve dual functions: securing the assembly and facilitating heat transfer, eliminating the need for separate gap pad materials.
3Ease of operation
If tool-free assembly is implemented, then ease of operation is improved, but manufacturing precision may be compromised
Solution Approach 1:
The patent designs the retention mechanism with self-aligning features and equipotential contact surfaces that naturally guide the M.2 card and heatsink into correct positions during tool-free assembly. The spring-loaded clips engage at multiple predetermined points that collectively ensure precise positioning without requiring alignment tools or complex assembly procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved thermal conductivity, increased power density, and enhanced reliability by maintaining consistent contact and reducing vibration, while allowing for easy assembly and disassembly without tools.
Implementation Method 1
a spring positioned in the retention carrier between the heatsink and the circuit board to apply a preload to the heatsink
Implementation Method 2
M.2 boards can be used to mount solid state storage, persistent memory (e.g., Intel ® Optane™) processors or other heat generating devices as a well as a heat sink
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
Examples described herein relate to a tool-less manner of forming an assembly with a circuit board carrier enclosure that provide leaf springs that provide a force against a circuit board to maintain a level surface of the circuit board. Multiple leaf springs can be used to apply a desired force to the circuit board. A heat sink can be mounted in the enclosure at a distance from the circuit board. The circuit board with carrier can be inserted without tools into an electrical connection for communications with other devices.