M.2 Memory Cooling Frame with Tool-less Heatsink Retention
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Solution Overview
Problem
The M.2 standard configuration for memory modules, which allows diverse electrical components of varying sizes and positions, poses challenges for universal-fit cooling assemblies, as they are not designed to accept heatsinks or heatsink clips, leading to thermal management issues and cumbersome cooling solutions that require custom modifications.
Innovation Solution
A tool-less cooling assembly with a cooling frame that supports both a bottom and top heatsink, using a seating tab and flexible tabs to secure the memory module and heatsinks, respectively, allowing for efficient installation and replacement without specialized tools, and accommodating different thermal dissipation profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a universal-fit cooling assembly is designed for M.2 memory modules with diverse component sizes and positions, then adaptability is improved, but device complexity increases due to the need to accommodate varying thermal profiles
Solution Approach 1:
The cooling frame is designed with a universal structure that can accommodate M.2 memory modules with diverse component sizes and positions. The frame includes a seating tab and flexible tabs that can adapt to different thermal profiles without requiring custom modifications,实现 one cooling assembly serving multiple configuration purposes
Solution Approach 2:
The flexible tabs in the cooling frame can bend and adjust to accommodate different heatsink positions and sizes. This dynamic flexibility allows the same cooling frame structure to adapt to various thermal management requirements while maintaining a simple overall design
2Temperature
If heatsinks are added to M.2 memory modules for thermal management, then temperature control is improved, but ease of operation deteriorates due to cumbersome installation requiring custom modifications
Solution Approach 1:
The cooling frame is pre-configured with seating tabs and flexible tabs in positions that automatically align with and secure heatsinks during installation. This preliminary arrangement eliminates the need for custom modifications or specialized tools, allowing users to install thermal management components through simple snap-fit operations
Solution Approach 2:
The flexible tabs automatically adjust and secure the heatsink in place through elastic deformation when the heatsink is inserted. The cooling assembly performs its own securing function without requiring external tools or complex fastening mechanisms, enabling tool-less installation
3Reliability
If a cooling frame with seating tabs is used to secure heatsinks, then reliability of thermal contact is improved, but manufacturing precision requirements increase
Solution Approach 1:
The flexible tabs utilize elastic deformation parameters to achieve reliable thermal contact. By allowing controlled bending and compression within elastic limits, the system compensates for minor dimensional variations in heatsink placement, maintaining reliable thermal contact without requiring extremely tight manufacturing tolerances
Solution Approach 2:
The flexible tabs are designed with pre-compression capability that compensates for potential gaps or misalignments before final thermal contact is established. This preliminary cushioning effect ensures reliable thermal connection even with moderate manufacturing variations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides optimized cooling for memory modules by securing both heatsinks within the cooling frame, enabling efficient thermal management and reducing assembly time and inventory needs, while ensuring safe and efficient service operations without requiring tools.
Implementation Method 1
a first heatsink positioned within a cooling frame and supported by a seating tab of the cooling frame that spans a memory module
Implementation Method 2
The solution provides optimized cooling for memory modules by securing both heatsinks within the cooling frame
Data Source
AI summary
An electronic memory module can be cooled by a cooling assembly that consists of at least a printed circuit board connected to at least one data storage component. The memory module may be housed within, and in physical contact with, a cooling frame that surrounds a periphery of the printed circuit board. The cooling frame can have a seating tab that is separated from the memory module, spans the memory module, and supports a heatsink in contact with the at least one data storage component.