Machine Tool Chip Expulsion Control for Adaptive Nozzle Cleaning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing machine tool systems face challenges in efficiently managing chip scattering and deposition during processing, as they lack adaptive control over chip expelling mechanisms to optimize cleaning liquid discharge based on real-time chip scattering directions.
Innovation Solution
A machine tool system with a cover equipped with multiple chip expelling mechanisms and a chip information obtaining unit that adjusts the discharge ability of nozzles based on the direction of maximum chip scattering, using a camera and image processing to determine the optimal nozzle operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If chip expelling mechanisms are disposed at multiple positions with fixed discharge ability, then chip removal coverage is improved, but chip management efficiency deteriorates due to inability to adapt to varying chip scattering patterns
Solution Approach 1:
The discharge ability of each chip expelling mechanism is made dynamically adjustable based on real-time chip scattering information. The control device receives scattering direction data from the chip information obtaining unit and dynamically modifies the discharge ability of corresponding nozzles, transforming the system from static to adaptive operation.
Solution Approach 2:
A feedback loop is established where the chip information obtaining unit continuously monitors chip scattering directions, and the control device uses this information to adjust the discharge ability of chip expelling mechanisms. This closed-loop control enables the system to adapt to changing chip scattering patterns during processing.
2Reliability
If cleaning liquid discharge is increased to wash away scattered chips, then chip adhesion prevention is improved, but energy consumption and fluid usage worsen
Solution Approach 1:
Instead of uniformly increasing cleaning liquid discharge across all nozzles, the system applies enhanced discharge ability only to specific nozzles corresponding to directions where chips have scattered. This localized approach concentrates cleaning resources where needed most, preventing chip adhesion without unnecessary energy and fluid consumption in other areas.
Solution Approach 2:
The discharge ability parameter of individual nozzles is dynamically changed based on chip scattering directions. The control device adjusts the discharge ability of each nozzle independently, increasing it for nozzles facing chip scattering directions and maintaining normal operation for others, thereby optimizing the balance between chip adhesion prevention and resource consumption.
Data Source
AI summary
The present invention provides a machine tool system including a machine tool body and a control device. The machine tool body includes: a cover that covers a machining region; chip expelling mechanisms that are disposed at a plurality of different positions inside the cover, that expel chips generated during processing, and a discharging ability of which is changeable; and a chip information obtaining unit that obtains information related to scattering directions of the chips during the processing. In accordance with the information related to the scattering directions of the chips and obtained by the chip information obtaining unit, the control device controls the discharging ability of one of the chip expelling mechanisms corresponding to a direction in which a largest amount of the chips have scattered so as to be larger than the discharging ability of another of the chip expelling mechanisms.