Machine Tool Electronics Cooling Outside the Fluid Flow Path

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Solution Overview

Problem

Existing electronics devices in machine tools face contamination and heat dissipation challenges due to fluid cooling systems, leading to potential short circuits and reduced service life, especially in heavily contaminated environments.

Innovation Solution

The electronics unit is positioned outside the fluid flow path of the cooling unit, with a heat diffusion element made from high thermal conductivity materials, and a fluid cooling element that directs the fluid flow to dissipate heat effectively, while a sealing unit ensures airtight protection against contaminants.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the electronics unit is placed inside the fluid flow path for direct cooling, then cooling efficiency is improved, but contamination risk increases

Engineering Contradiction:
Improvecooling efficiencyVSAvoidcontamination risk
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

A fluid cooling element is introduced as an intermediary component between the electronics unit and the fluid flow path. The fluid cooling element absorbs heat from the electronics unit through thermal conduction and transfers it to the fluid, enabling indirect cooling that prevents contamination while maintaining cooling efficiency

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The electronics unit is extracted from the fluid flow path and positioned outside it, eliminating direct contact between the electronics and the fluid. This separation removes the contamination risk while the fluid cooling element mediates the heat transfer function

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If the electronics unit is positioned outside the fluid flow path to prevent contamination, then reliability is improved, but cooling efficiency decreases

Engineering Contradiction:
Improveservice lifeVSAvoidheat dissipation efficiency
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The fluid cooling element serves as a thermal intermediary that maintains efficient heat transfer between the electronics unit and the fluid flow path without requiring direct contact. This mediator enables the electronics to be positioned outside the fluid path while preserving cooling performance

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

Direct mechanical contact cooling is replaced with thermal conduction through the fluid cooling element. This substitution allows heat transfer to occur through the element's material properties rather than requiring the electronics to be physically immersed in the fluid

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Object-affected harmful factors

If a sealing unit is added to protect against contaminants, then protection is improved, but device complexity increases

Engineering Contradiction:
Improveprotection against contaminantsVSAvoidstructure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The sealing function is merged with the fluid cooling element by forming an integrated sealing unit that combines the cooling element and sealing components into a single unified structure. This integration provides contamination protection without adding separate complex sealing mechanisms

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design prevents contamination and ensures effective cooling, extending the service life and ensuring error-free operation of machine tools in harsh conditions by effectively dissipating heat and protecting against foreign bodies.

Implementation Method 1

a heat diffusion element made from high thermal conductivity materials

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

at least one fluid cooling unit for cooling the electronic unit by means of a fluid

Methodology Applied
Scientific EffectConvection cooling: Convection

Data Source

PatentEP4084933B1Electronic apparatus and machine tool having said electronic apparatus
Publication Date: 2024.04.24 ROBERT BOSCH GMBH
  • EP4084933B1 patent drawingFigure 1
  • EP4084933B1 patent drawingFigure 2
  • EP4084933B1 patent drawingFigure 3

AI summary

The invention relates to an electronic apparatus for a machine tool, having at least one electronic unit (18a; 18c; 18d; 18e; 18f; 18g) and having at least one fluid cooling unit (30a; 30c; 30d; 30e; 30f; 30g) for cooling the electronic unit (18a; 18c; 18d; 18e; 18f; 18g) by means of a fluid. According to the invention, the electronic unit (18a; 18c; 18d; 18e; 18f; 18g) is arranged at least primarily, in particular completely, outside of a fluid flow path (32a; 32c; 32d; 32e; 32f; 32g) of the fluid cooling unit (30a; 30c; 30d; 30e; 30f; 30g).