Maglev Substrate Transfer Module for Compact Chamber Integration
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Solution Overview
Problem
Existing substrate transfer mechanisms in semiconductor wafer processing increase the footprint of installed equipment, necessitating a more compact and efficient transfer solution.
Innovation Solution
A substrate processing apparatus utilizing magnetic levitation for transferring substrates within a substrate transfer chamber, where a movable stage with a repulsive magnetic force is used to transfer substrates through an opening into a processing chamber, maintaining a non-contact state and minimizing equipment footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a substrate transfer mechanism is installed to transfer wafers between carrier and processing chamber, then substrate transfer function is achieved, but footprint of installed equipment increases
Solution Approach 1:
The substrate transfer mechanism is merged with the processing chamber structure. The transfer table is integrated into the processing chamber, and the same chamber serves both as processing space and transfer pathway, eliminating the need for separate transfer chambers and reducing overall equipment footprint.
Solution Approach 2:
The processing chamber is designed to serve multiple functions: it acts as both the substrate processing environment and the substrate transfer pathway. The transfer table within the chamber can function as both a processing platform and a transfer mechanism, allowing one component to perform multiple roles and reduce space requirements.
2Object-affected harmful factors
If magnetic levitation is used for substrate transfer, then non-contact transfer and cleanliness are achieved, but device complexity increases
Solution Approach 1:
The mechanical contact-based transfer system is replaced with a magnetic levitation system. Magnets mounted on the transfer table interact with the processing chamber structure to achieve non-contact support and movement, eliminating mechanical friction and contamination while maintaining transfer functionality.
3Ease of operation
If processing chamber opening is made large enough for stage to pass through, then substrate transfer is enabled, but chamber sealing and contamination control become difficult
Solution Approach 1:
The processing chamber opening is designed to dynamically adjust its effective size. The transfer table can be raised to present a smaller profile when passing through the opening, and lowered to provide full substrate access during processing, allowing the same opening to accommodate both transfer and processing requirements while maintaining sealing integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves efficient substrate transfer while reducing the footprint of installed equipment and ensuring continuous cleanliness of the transfer stage, thereby minimizing contamination and space requirements.
Implementation Method 1
a substrate transfer module including a stage on which a substrate is placed, a traveling plate disposed below the stage, and a second magnet having a repulsive force with respect to the first magnet, and the substrate transfer module being configured to be movable in the substrate transfer chamber by magnetic levitation using the repulsive force
Data Source
AI summary
There is provided a substrate processing apparatus comprising: a substrate transfer chamber having a floor provided with a first magnet a substrate transfer module including a stage on which a substrate is placed, a traveling plate disposed below the stage, and a second magnet having a repulsive force with respect to the first magnet, the substrate transfer module being configured to be movable in the substrate transfer chamber by magnetic levitation using the repulsive force; and a substrate processing chamber disposed on an upper surface side of the substrate transfer chamber to process the substrate, the substrate processing chamber having an opening having a size that allows at least a part of the stage on which the substrate is placed to pass therethrough, the opening being open toward the inside of the substrate transfer chamber. The substrate is processed in a state where the stage on which the substrate is placed is inserted into the substrate processing chamber through the opening by raising the substrate transfer module and the opening is closed by the traveling plate.