Maglev Substrate Transfer Control for Variable Wafer Loads
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Solution Overview
Problem
Existing wafer processing systems face challenges in accurately controlling the movement of substrate transfer modules when handling objects other than standard wafers, such as damaged wafers or equipment, due to variations in weight and shape, leading to inefficiencies and opportunities for equipment downtime.
Innovation Solution
A substrate transfer system utilizing magnetic levitation with a controller that employs feedforward control and adjustable magnetic forces, coupled with model parameters for different types of objects, to ensure precise movement control through a control schedule adjusted based on object identification and movement schedules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a substrate transfer module uses magnetic levitation to transfer substrates, then transfer speed and efficiency are improved, but accurate movement control becomes difficult when handling objects other than standard substrates (such as damaged wafers or equipment) due to variations in weight and shape
Solution Approach 1:
The patent applies dynamics by making the magnetic force adjustable in real-time. The magnetic force adjusting section dynamically modifies the magnetic force based on feedback from position detection and pre-stored model parameters, allowing the system to adapt to different objects (substrates, damaged wafers, equipment) while maintaining accurate movement control throughout the transfer process
Solution Approach 2:
The patent implements feedback control through the position detection section that continuously monitors the substrate transfer module's position and feeds this information back to the controller. The controller compares actual position with target position and adjusts magnetic force accordingly, ensuring accurate movement control even when transferring objects with varying weight and shape
2Manufacturing precision
If the substrate transfer module is designed for standard substrate transfer, then transfer precision is optimized, but adaptability to transfer other objects (equipment, damaged wafers) is reduced
Solution Approach 1:
The patent achieves universality by designing the substrate transfer module to handle multiple types of objects including standard substrates, damaged wafers, and equipment. The holder can accommodate different objects, and the control system adapts to each object type using model parameters stored in the parameter storage section, allowing one module to perform multiple transfer functions
Solution Approach 2:
The patent applies parameter changes by storing multiple sets of model parameters in the parameter storage section, each corresponding to different object types. When transferring a specific object, the controller selects and applies the appropriate parameters (such as mass, moment of inertia, center of gravity position), enabling precise control adaptation without hardware modifications
3Device complexity
If different objects are transferred using a fixed control system, then system complexity is minimized, but control accuracy for varied objects deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-storing model parameters for different object types in the parameter storage section before actual transfer operations. These parameters (mass, moment of inertia, center of gravity) are prepared in advance, allowing the controller to quickly select and apply appropriate control parameters when a specific object needs to be transferred, avoiding complex real-time calculations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient transfer of various objects within the system, reducing downtime by allowing for seamless switching between different types of operations without the need for atmospheric pressure changes, thus optimizing equipment utilization.
Implementation Method 1
second magnets having a repulsive force acting on the first magnets, the substrate transfer module being configured to be movable in the substrate transfer chamber by magnetic levitation using the repulsive force
Data Source
AI summary
An apparatus for transferring a substrate to a substrate processing chamber. The apparatus comprises: a substrate transfer chamber having a floor and a side wall; a substrate transfer module comprising a holder and second magnets, and configured to be movable in the substrate transfer chamber by magnetic levitation; and a controller configured to control an operating force for moving the substrate transfer module. The controller comprises: a parameter storage configured to store at least one model parameter; a control schedule creating section configured to acquire identification information and a movement schedule, to obtain the operating force, and to output a control schedule; and a magnetic force adjusting section configured to perform feedforward control.