Magnetic Levitation Substrate Transfer Module Self-Cleaning
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Solution Overview
Problem
In semiconductor wafer processing, contaminants such as particles and chemical substances adhere to and accumulate on the substrate transfer module using magnetic levitation, leading to contamination of the substrate during transfer.
Innovation Solution
A substrate transfer apparatus with a heating device that utilizes magnetic levitation to heat the transfer module, releasing contaminants from its surface through thermal stress and thermophoretic forces, thereby cleaning the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a substrate transfer module using magnetic levitation is used to transfer substrates, then substrate transfer efficiency and precision are improved, but contaminants accumulate on the transfer module surface causing substrate contamination
Solution Approach 1:
The patent applies thermal field parameter changes by heating the substrate transfer module to high temperatures. This temperature parameter change causes contaminants to be released from the module surface through thermal stress and thermophoretic forces, thereby preventing substrate contamination while maintaining efficient magnetic levitation transfer
Solution Approach 2:
The patent converts the harmful accumulation of contaminants on the transfer module into a beneficial cleaning process. By intentionally applying thermal stress through heating, the accumulated contaminants are released and removed, transforming the contamination problem into a self-cleaning mechanism that maintains transfer module purity
2Object-affected harmful factors
If heating is applied to release contaminants from the transfer module, then substrate contamination is prevented, but energy consumption increases
Solution Approach 1:
The patent implements periodic heating cycles rather than continuous heating. The heating device operates intermittently to release contaminants at specific intervals, which prevents substrate contamination while minimizing energy consumption by avoiding constant thermal input to the transfer module
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes contaminants from the substrate transfer module, preventing substrate contamination and maintaining cleanliness during the transfer process.
Implementation Method 1
a second magnet having a repulsive force against the first magnet, and configured to move in the substrate transfer chamber by magnetic levitation using the repulsive force
Implementation Method 2
heating the substrate transfer module to release contaminants adhered to a surface of the substrate transfer module
Implementation Method 3
releasing contaminants from its surface through thermal stress and thermophoretic forces
Data Source
AI summary
An apparatus for transferring a substrate to a substrate processing chamber is provided. The apparatus comprises: a substrate transfer chamber having a floor provided with a first magnet and a sidewall connected to the substrate processing chamber and having an opening through which a substrate is loaded into and unloaded from the substrate processing chamber; a substrate transfer module including a substrate holder configured to hold the substrate and a second magnet having a repulsive force against the first magnet, and configured to move in the substrate transfer chamber by magnetic levitation using the repulsive force; and a heating device configured to heat the substrate transfer module to release contaminants adhered to a surface of the substrate transfer module.


