Magnetic Levitation Substrate Transfer Module Self-Cleaning

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Solution Overview

Problem

In semiconductor wafer processing, contaminants such as particles and chemical substances adhere to and accumulate on the substrate transfer module using magnetic levitation, leading to contamination of the substrate during transfer.

Innovation Solution

A substrate transfer apparatus with a heating device that utilizes magnetic levitation to heat the transfer module, releasing contaminants from its surface through thermal stress and thermophoretic forces, thereby cleaning the module.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a substrate transfer module using magnetic levitation is used to transfer substrates, then substrate transfer efficiency and precision are improved, but contaminants accumulate on the transfer module surface causing substrate contamination

Engineering Contradiction:
Improvesubstrate transfer efficiencyVSAvoidsubstrate contamination
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent applies thermal field parameter changes by heating the substrate transfer module to high temperatures. This temperature parameter change causes contaminants to be released from the module surface through thermal stress and thermophoretic forces, thereby preventing substrate contamination while maintaining efficient magnetic levitation transfer

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent converts the harmful accumulation of contaminants on the transfer module into a beneficial cleaning process. By intentionally applying thermal stress through heating, the accumulated contaminants are released and removed, transforming the contamination problem into a self-cleaning mechanism that maintains transfer module purity

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Object-affected harmful factors

If heating is applied to release contaminants from the transfer module, then substrate contamination is prevented, but energy consumption increases

Engineering Contradiction:
Improvesubstrate contaminationVSAvoidenergy consumption
Core Design Contradiction:
Object-affected harmful factorsVSUse of energy by moving object

Solution Approach 1:

The patent implements periodic heating cycles rather than continuous heating. The heating device operates intermittently to release contaminants at specific intervals, which prevents substrate contamination while minimizing energy consumption by avoiding constant thermal input to the transfer module

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively removes contaminants from the substrate transfer module, preventing substrate contamination and maintaining cleanliness during the transfer process.

Implementation Method 1

a second magnet having a repulsive force against the first magnet, and configured to move in the substrate transfer chamber by magnetic levitation using the repulsive force

Methodology Applied
Scientific EffectMagnetic levitation: Maglev

Implementation Method 2

heating the substrate transfer module to release contaminants adhered to a surface of the substrate transfer module

Methodology Applied
Scientific EffectThermal stress: Thermal Shock

Implementation Method 3

releasing contaminants from its surface through thermal stress and thermophoretic forces

Methodology Applied
Scientific EffectThermophoresis: Thermophoresis

Data Source

PatentUS20230143372A1Substrate transfer apparatus and substrate transfer method
Publication Date: 2023.05.11 TOKYO ELECTRON LTD
  • US20230143372A1 patent drawing
  • US20230143372A1 patent drawing
  • US20230143372A1 patent drawing

AI summary

An apparatus for transferring a substrate to a substrate processing chamber is provided. The apparatus comprises: a substrate transfer chamber having a floor provided with a first magnet and a sidewall connected to the substrate processing chamber and having an opening through which a substrate is loaded into and unloaded from the substrate processing chamber; a substrate transfer module including a substrate holder configured to hold the substrate and a second magnet having a repulsive force against the first magnet, and configured to move in the substrate transfer chamber by magnetic levitation using the repulsive force; and a heating device configured to heat the substrate transfer module to release contaminants adhered to a surface of the substrate transfer module.