Maglev Substrate Transfer Assembly for Low-Particle Semiconductor Processing
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Solution Overview
Problem
Conventional substrate transfer systems in semiconductor processing face challenges with particle generation, large footprint, and limited throughput due to mechanical robots and conveyors, which affect vacuum integrity and processing efficiency.
Innovation Solution
The use of magnetic levitation assemblies to convey and transfer substrates within a substrate processing system, eliminating mechanical robots and conveyors, thereby reducing particle generation and footprint while increasing throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If conventional mechanical robots are used for substrate transfer, then substrate transfer function is achieved, but particle generation increases and footprint enlarges
Solution Approach 1:
The patent replaces mechanical robots with a magnetic field-based transfer mechanism. Magnets embedded in the pedestal assembly attract and hold substrates, enabling transfer without mechanical contact. This eliminates particle generation from mechanical components while maintaining the substrate transfer function.
Solution Approach 2:
The patent removes the mechanical robot component entirely from the system. By extracting the mechanical transfer mechanism and replacing it with a magnetic field-based system, the source of particle generation is eliminated while the essential substrate transfer capability is preserved through magnetic attraction and movement.
2Object-generated harmful factors
If conventional mechanical conveyors are used for substrate transport, then substrate movement is achieved, but particle contamination increases
Solution Approach 1:
The patent replaces mechanical conveyors with a magnetic field-based transport system. Magnets in the pedestal assembly enable substrate movement through magnetic attraction and release cycles, eliminating the need for mechanical conveyor components that generate particles.
Solution Approach 2:
The patent introduces a magnetic field as an intermediary between the pedestal and substrate. This magnetic field acts as a non-contact mediator to transfer and move substrates without mechanical contact, thereby preventing particle contamination while achieving the required substrate transport.
3Area of stationary object
If mechanical robots rotate and extend into process chambers, then substrate transfer between chambers is achieved, but footprint of central region increases
Solution Approach 1:
The patent replaces the rotating mechanical robot arm with a magnetic field-based transfer system. The magnets in the pedestal assembly can attract and move substrates horizontally and vertically without requiring rotation or extension mechanisms, significantly reducing the footprint of the central transfer region while maintaining full substrate transfer capability between process chambers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Magnetic levitation reduces particle contamination, minimizes system footprint, and enhances processing efficiency by up to 50% through increased throughput.
Implementation Method 1
a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier
Implementation Method 2
the first rails each include a first plurality of magnets
Data Source
AI summary
A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.