Maglev Substrate Transfer for High-Vacuum Wafer Handling

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Solution Overview

Problem

Existing substrate transfer devices in semiconductor manufacturing face challenges in maintaining a high vacuum due to gas intrusion from vacuum seals and limited throughput due to movement restrictions of transfer robots.

Innovation Solution

A vacuum transfer device utilizing a flat motor with electromagnetic coils and a current controller, combined with a transfer unit featuring magnetic levitation and a temperature adjusting mechanism, to maintain a high vacuum and enhance throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a transfer robot with articulated arm structure is used, then the substrate can be transferred between chambers, but gas intrusion from vacuum seals reduces vacuum quality and movement limitations decrease throughput

Engineering Contradiction:
Improvevacuum qualityVSAvoidthroughput
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent replaces the mechanical articulated arm transfer robot with a magnetic field-based transfer system. The substrate holder is levitated and driven by electromagnetic coils, eliminating mechanical contacts and vacuum seals that cause gas intrusion. This substitution maintains high vacuum quality while enabling faster, more flexible substrate transfer movements to improve throughput.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent uses electromagnetic fields (a form of field-based physics similar to pneumatic/hydraulic principles) to levitate and drive the substrate holder without mechanical contact. The electromagnetic coils generate magnetic fields that propel the substrate holder along the transfer path, replacing mechanical drive systems and eliminating the need for vacuum seals at moving joints.

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Reliability

If magnetic levitation is used to eliminate vacuum seals, then gas intrusion is prevented, but temperature control of the transfer unit becomes challenging

Engineering Contradiction:
Improvevacuum qualityVSAvoidtemperature control
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent introduces a temperature-adjusting mechanism as an intermediary between the electromagnetic coils and the substrate holder. This mechanism includes temperature sensors and heating/cooling elements that actively control the temperature of the substrate holder and surrounding components, compensating for thermal effects caused by electromagnetic coil operation and ensuring stable substrate transfer conditions.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents gas intrusion, maintains a high vacuum, and increases throughput by allowing greater freedom of movement for the transfer unit, while also addressing temperature-related transfer accuracy issues.

Implementation Method 1

a base having a plurality of magnets arrayed therein and configured to magnetically levitate from a surface of the body by a magnetic field generated by supplying power to the electromagnetic coil

Methodology Applied
Scientific EffectMagnetic levitation: Maglev

Implementation Method 2

by a magnetic field generated by supplying power to the electromagnetic coil

Methodology Applied
Scientific EffectMagnetic field: Magnetic Field

Implementation Method 3

A temperature of the transfer unit is adjusted by controlling the current supplied to the electromagnetic coil by the current controller to stop the magnetic levitation of the base, and bringing the base into contact with a temperature-adjusted portion of the body

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12211720B2Vacuum transfer device, substrate processing system, and substrate processing method
Publication Date: 2025.01.28 TOKYO ELECTRON LTD
  • US12211720B2 patent drawing
  • US12211720B2 patent drawing
  • US12211720B2 patent drawing

AI summary

A vacuum transfer device configured to transfer a substrate in a vacuum includes: a flat motor including a body, a plurality of electromagnetic coils arrayed in the body, and a current controller that controls a current supplied to the electromagnetic coil; a transfer unit including a substrate holder configured to hold a substrate, and a base having a plurality of magnets arrayed therein and magnetically levitating from a surface of the body by a magnetic field generated by the electromagnetic coil, and move in a magnetically levitating state thereby moving the substrate holder; and a temperature controller configured to adjust temperature of at least a portion of the body. The temperature of the transfer unit is adjusted by stopping the magnetic levitation of the base by controlling the current supplied to the electromagnetic coil, and bringing the base into contact with a temperature-adjusted portion of the body.