Maglev Vacuum Substrate Transport Layout for Parallel Processing
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Solution Overview
Problem
Existing substrate processing systems face inefficiencies in transporting and processing substrates between different environments and modules, leading to reduced productivity and increased installation area requirements.
Innovation Solution
A substrate processing system utilizing magnetic levitation type vacuum transport units and load lock modules to facilitate horizontal and vertical transport of substrates between load ports, upper and lower processing modules, and atmospheric and vacuum environments, with integrated transport robots and motors for efficient substrate handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are transported sequentially between processing modules, then transport reliability is maintained, but productivity decreases due to serial processing
Solution Approach 1:
The patent introduces a vertical transport dimension by placing processing modules at different heights (upper and lower levels) and using vertical movement mechanisms. This multi-level configuration enables parallel substrate processing while maintaining organized transport paths, resolving the contradiction between increased productivity and system complexity.
Solution Approach 2:
The transport system is segmented into multiple independent magnetic levitation transport units that can operate autonomously. Each transport unit handles specific substrate routes between modules, allowing parallel operations and improving throughput without requiring a monolithic complex system.
2Productivity
If multiple processing modules are installed to enable parallel processing, then productivity increases, but installation area increases
Solution Approach 1:
Processing modules are arranged in vertical stacks at different heights rather than spreading horizontally. The upper and lower processing modules share the same horizontal footprint space by utilizing the vertical dimension, enabling parallel processing while minimizing installation area.
Solution Approach 2:
The system nests multiple processing modules and transport mechanisms within a compact vertical structure. The upper and lower modules are positioned to share common infrastructure and space, effectively nesting functional units to reduce overall footprint while maintaining parallel processing capability.
3Speed
If magnetic levitation transport units are used, then transport speed and precision improve, but device complexity increases
Solution Approach 1:
The patent replaces traditional mechanical contact-based transport mechanisms with magnetic levitation technology. This substitution eliminates mechanical friction and contact wear, enabling faster and more precise substrate transport while reducing mechanical complexity through contactless operation.
Solution Approach 2:
Magnetic fields serve as an intermediary between the transport units and substrates, enabling contactless manipulation and transport. This intermediary approach allows for precise control and high-speed operation without direct mechanical contact, simplifying the overall mechanical system while improving performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances transport efficiency and productivity by allowing parallel processing of substrates in multiple modules while minimizing installation space, thereby improving overall system performance.
Implementation Method 1
a plurality of upper magnetic levitation type vacuum transport units disposed at a second height, the plurality of upper magnetic levitation type vacuum transport units being connected in a horizontal direction along a first direction
Implementation Method 2
a load lock module configured to switch an internal environment between an atmospheric environment and a vacuum environment
Data Source
AI summary
Provided is a substrate processing system including a load port disposed at a first height, a plurality of upper magnetic levitation type vacuum transport units disposed at a second height, a plurality of upper substrate processing modules, a plurality of lower magnetic levitation type vacuum transport units disposed at a third height lower than the second height, a plurality of lower substrate processing modules, and a load lock module configured to switch an internal environment between an atmospheric environment and a vacuum environment.


