Maglev Wafer Transfer Stage for Compact Clean Substrate Processing

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Solution Overview

Problem

Existing substrate transfer mechanisms in semiconductor wafer processing increase the footprint of installed equipment, necessitating a more efficient and compact transfer solution.

Innovation Solution

A substrate processing apparatus utilizing magnetic levitation for transferring substrates within a substrate transfer chamber, where a movable stage with a repulsive magnetic force is used to transfer substrates through an opening into a processing chamber, maintaining a non-contact state and minimizing equipment footprint.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional substrate transfer mechanism is used, then substrate transfer can be achieved, but the footprint of installed equipment increases

Engineering Contradiction:

Improvesubstrate transfer capabilityVSAvoidequipment footprint

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent replaces conventional mechanical contact-based substrate transfer mechanisms with a magnetic levitation system. The stage is levitated above the track using magnetic repulsion forces between magnets on the stage and corresponding magnets on the track, eliminating the need for mechanical contact components and reducing the overall equipment footprint while maintaining reliable substrate transfer capability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent transitions from horizontal substrate transfer to vertical substrate transfer by raising the stage into the processing chamber through the opening. This dimensional change allows the processing chamber to be disposed on the upper surface side of the transfer chamber, optimizing space utilization and reducing equipment footprint

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If magnetic levitation is used for substrate transfer, then equipment footprint is reduced, but system complexity increases

Engineering Contradiction:

Improveequipment footprintVSAvoidmagnetic levitation system complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The magnetic levitation system is segmented into distinct functional modules: magnets mounted on the stage, corresponding magnets on the track, and a control system. This segmentation allows for easier design, manufacturing, and maintenance while reducing overall system complexity despite the advanced technology used

Inventive Principle:

Principle #1Segmentation

3Productivity

If the stage is raised into the processing chamber through the opening, then substrate transfer efficiency is improved, but contamination risk increases

Engineering Contradiction:

Improvesubstrate transfer efficiencyVSAvoidcontamination risk

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

By using magnetic levitation instead of mechanical contact, the system eliminates friction and physical wear that could generate particles. The non-contact transfer mechanism reduces contamination risk while maintaining efficient substrate transfer through the opening into the processing chamber

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus achieves efficient substrate transfer while reducing the overall equipment footprint and maintaining a clean transfer environment, suppressing contamination and height expansion.

Implementation Method 1

a second magnet having a repulsive force with respect to the first magnet, and the substrate transfer module being configured to be movable in the substrate transfer chamber by magnetic levitation using the repulsive force

Methodology Applied

Scientific EffectMagnetic repulsion: Magnetism

Data Source

PatentUS20260047385A1Substrate processing device and substrate processing method

Publication Date: 2026.02.12 TOKYO ELECTRON LTD

AI summary

There is provided a substrate processing apparatus comprising: a substrate transfer chamber having a floor provided with a first magnet; a substrate transfer module including a stage on which a substrate is placed, a traveling plate disposed below the stage, and a second magnet having a repulsive force with respect to the first magnet, the substrate transfer module being configured to be movable in the substrate transfer chamber by magnetic levitation using the repulsive force; and a substrate processing chamber disposed on an upper surface side of the substrate transfer chamber to process the substrate, the substrate processing chamber having an opening having a size that allows at least a part of the stage on which the substrate is placed to pass therethrough, the opening being open toward the inside of the substrate transfer chamber. The substrate is processed in a state where the stage on which the substrate is placed is inserted into the substrate processing chamber through the opening by raising the substrate transfer module and the opening is closed by the traveling plate.