Magnesium Alloy Substrate Container for Contamination Control
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Solution Overview
Problem
Semiconductor substrate containers face challenges with contamination, electrostatic discharge sensitivity, and handling issues due to conventional polymer materials, which affect the integrity and efficiency of wafer processing and transport.
Innovation Solution
The use of injection molded magnesium alloy components with semi-solid metal properties for containment and polymer components in substrate containers, allowing for varied wall thickness, electrostatic dissipation, and improved handling characteristics, along with a method of thixomolding and coating for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If polymer-based containers are used for substrate storage and transport, then cost effectiveness and ease of manufacture are improved, but contamination control and electrostatic discharge protection deteriorate
Solution Approach 1:
The patent employs composite material construction by combining polymer components with metal components (aluminum or stainless steel). The container shell, door, and internal structures use polymers for cost-effective manufacturing, while metal purge pipes, seals, and electrostatic dissipative components provide contamination control and ESD protection. This hybrid approach resolves the contradiction by integrating the advantages of both material types.
Solution Approach 2:
The patent changes the material parameter from pure polymer to a hybrid polymer-metal construction. Specifically, it introduces metal components with specific properties (electrostatic dissipative, low outgassing) into the polymer-based container system, thereby changing the overall material parameters to simultaneously achieve cost-effectiveness and contamination control.
2Ease of manufacture
If polymer-based containers are used for substrate storage and transport, then cost effectiveness and ease of manufacture are improved, but electrostatic discharge protection deteriorates
Solution Approach 1:
The patent employs composite material construction by combining polymer components with metal components (aluminum or stainless steel). The container shell, door, and internal structures use polymers for cost-effective manufacturing, while metal purge pipes, seals, and electrostatic dissipative components provide contamination control and ESD protection. This hybrid approach resolves the contradiction by integrating the advantages of both material types.
Solution Approach 2:
The patent changes the material parameter from pure polymer to a hybrid polymer-metal construction. Specifically, it introduces metal components with specific properties (electrostatic dissipative, low outgassing) into the polymer-based container system, thereby changing the overall material parameters to simultaneously achieve cost-effectiveness and contamination control.
3Device complexity
If conventional polymer containers are used, then manufacturing simplicity is improved, but handling robustness and strength deteriorate
Solution Approach 1:
The patent employs composite material construction by combining polymer components with metal components (aluminum or stainless steel). The container shell, door, and internal structures use polymers for manufacturing simplicity, while metal reinforcement elements, hinges, and structural components provide enhanced strength and handling robustness.
Solution Approach 2:
The patent divides the container into distinct polymer segments and metal segments, each optimized for their respective functions. Polymer segments provide manufacturing simplicity and cost-effectiveness, while metal segments provide structural strength. This segmentation allows each material to be manufactured and assembled in its optimal form.
4Quantity of substance
If polymer containers with varied wall thickness are designed, then material efficiency is improved, but manufacturing precision and dimensional stability deteriorate
Solution Approach 1:
The patent divides the container into distinct polymer segments and metal segments, each optimized for their respective functions. Polymer segments provide manufacturing simplicity and cost-effectiveness, while metal segments provide structural strength. This segmentation allows each material to be manufactured and assembled in its optimal form.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved strength, reduced contamination, effective electrostatic discharge management, and balanced handling, enabling efficient transport and storage of semiconductor wafers with enhanced permeation control and reduced environmental impact.
Implementation Method 1
heating and applying shear to the magnesium alloy to form a slurry; injecting the slurry into a mold
Implementation Method 2
conductive or electrostatically dissipative coating on the container portion
Implementation Method 3
The door has a seal to hermetically seal to the shell
Data Source
AI summary
Substrate containers and/or portions thereof for use in the semiconductor manufacturing industry can be formed by injection molding metal slurries. More particularly, such substrate containers and/or portions thereof can be formed by injection molding metal slurries containing magnesium or magnesium alloys. Substrate containers, wherein at least a portion of the substrate container is injection molded from a metal slurry containing magnesium or magnesium alloy can exhibit improved permeation control of moisture and oxygen over, and as compared to, comparable substrate carriers formed of polymer based materials. Exemplary substrate containers can include wafer containers, reticle pods, disk shippers and/or work-in-process boxes.